A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations
Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale performance in a cost-efficient manner. As the number of cores scales up, not all cores can be directly connected to the main memory and there is a need for hierarchy, for exa...
Gespeichert in:
Veröffentlicht in: | IEEE transactions on circuits and systems. I, Regular papers Regular papers, 2011-03, Vol.58 (3), p.529-538 |
---|---|
Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 538 |
---|---|
container_issue | 3 |
container_start_page | 529 |
container_title | IEEE transactions on circuits and systems. I, Regular papers |
container_volume | 58 |
creator | Golander, Amit Levison, Nadav Heymann, Omer Briskman, Alexander Wolski, Mark J Robinson, Eric F |
description | Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale performance in a cost-efficient manner. As the number of cores scales up, not all cores can be directly connected to the main memory and there is a need for hierarchy, for example, by arranging them in clusters that share L2 caches. This paper focuses on designing cost-efficient L1-L2 interconnects. We discuss performance and power- and area-consumption considerations for a real processor designed in 45-nm technology. We explain the architectures and heuristics developed, including a smart floorplan with instance flips to address interconnect latency, customized decentralized arbitration schemes tailored per transaction type, and heterogeneous Vt device assignment to reduce overall power consumption, taking into account the expected switching factors. These and other methods worked together to achieve high throughput in a power-efficient interconnect that consumes less than 3% of the compute cluster area. |
doi_str_mv | 10.1109/TCSI.2010.2073832 |
format | Article |
fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_5644727</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5644727</ieee_id><sourcerecordid>1671228585</sourcerecordid><originalsourceid>FETCH-LOGICAL-c255t-a4f00370467f6bccaa3a9e4e714701bbcb66c7b8d502f60cb6facb0bc45d5e2b3</originalsourceid><addsrcrecordid>eNpdkE9LAzEQxRdRsFY_gHhZPHno6iSbP7veylK1ULFgvXgJ2XQCW9qkJlvEb29KiwdPM2_m94bhZdk1gXtCoH5YNO_TewpJUpBlVdKTbEA4rwqoQJzue1YXaVydZxcxrgBoDSUZZJ_jvPGxLybWdqZD1-czUsxo_rpb953xAfOp6zEY7xya_jGfY7A-bLQzOMrn_hvDKNdumY8D6nTJxW6JQfdd6i6zM6vXEa-OdZh9PE0WzUsxe3ueNuNZYSjnfaGZBSglMCGtaI3RutQ1MpSESSBta1ohjGyrJQdqBSRptWmhNYwvOdK2HGZ3h7vb4L92GHu16aLB9Vo79LuoiJCE0opXPKG3_9CV3wWXvlNpWwlW12WCyAEywccY0Kpt6DY6_CgCah-22oet9mGrY9jJc3PwdIj4x3PBmKSy_AVPdXon</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>853864993</pqid></control><display><type>article</type><title>A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations</title><source>IEEE Electronic Library (IEL)</source><creator>Golander, Amit ; Levison, Nadav ; Heymann, Omer ; Briskman, Alexander ; Wolski, Mark J ; Robinson, Eric F</creator><creatorcontrib>Golander, Amit ; Levison, Nadav ; Heymann, Omer ; Briskman, Alexander ; Wolski, Mark J ; Robinson, Eric F</creatorcontrib><description>Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale performance in a cost-efficient manner. As the number of cores scales up, not all cores can be directly connected to the main memory and there is a need for hierarchy, for example, by arranging them in clusters that share L2 caches. This paper focuses on designing cost-efficient L1-L2 interconnects. We discuss performance and power- and area-consumption considerations for a real processor designed in 45-nm technology. We explain the architectures and heuristics developed, including a smart floorplan with instance flips to address interconnect latency, customized decentralized arbitration schemes tailored per transaction type, and heterogeneous Vt device assignment to reduce overall power consumption, taking into account the expected switching factors. These and other methods worked together to achieve high throughput in a power-efficient interconnect that consumes less than 3% of the compute cluster area.</description><identifier>ISSN: 1549-8328</identifier><identifier>EISSN: 1558-0806</identifier><identifier>DOI: 10.1109/TCSI.2010.2073832</identifier><identifier>CODEN: ITCSCH</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Arbitration ; Chip multiprocessor (CMP) ; Circuits ; Clocks ; Clusters ; computer architecture ; Consumption ; Hierarchies ; Integrated circuit interconnections ; interconnect architectures ; Latches ; leakage ; Metals ; Microprocessors ; multiprocessors ; power ; Power consumption ; ring ; Switches ; Switching ; Timing ; Wire</subject><ispartof>IEEE transactions on circuits and systems. I, Regular papers, 2011-03, Vol.58 (3), p.529-538</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Mar 2011</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c255t-a4f00370467f6bccaa3a9e4e714701bbcb66c7b8d502f60cb6facb0bc45d5e2b3</citedby><cites>FETCH-LOGICAL-c255t-a4f00370467f6bccaa3a9e4e714701bbcb66c7b8d502f60cb6facb0bc45d5e2b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5644727$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5644727$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Golander, Amit</creatorcontrib><creatorcontrib>Levison, Nadav</creatorcontrib><creatorcontrib>Heymann, Omer</creatorcontrib><creatorcontrib>Briskman, Alexander</creatorcontrib><creatorcontrib>Wolski, Mark J</creatorcontrib><creatorcontrib>Robinson, Eric F</creatorcontrib><title>A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations</title><title>IEEE transactions on circuits and systems. I, Regular papers</title><addtitle>TCSI</addtitle><description>Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale performance in a cost-efficient manner. As the number of cores scales up, not all cores can be directly connected to the main memory and there is a need for hierarchy, for example, by arranging them in clusters that share L2 caches. This paper focuses on designing cost-efficient L1-L2 interconnects. We discuss performance and power- and area-consumption considerations for a real processor designed in 45-nm technology. We explain the architectures and heuristics developed, including a smart floorplan with instance flips to address interconnect latency, customized decentralized arbitration schemes tailored per transaction type, and heterogeneous Vt device assignment to reduce overall power consumption, taking into account the expected switching factors. These and other methods worked together to achieve high throughput in a power-efficient interconnect that consumes less than 3% of the compute cluster area.</description><subject>Arbitration</subject><subject>Chip multiprocessor (CMP)</subject><subject>Circuits</subject><subject>Clocks</subject><subject>Clusters</subject><subject>computer architecture</subject><subject>Consumption</subject><subject>Hierarchies</subject><subject>Integrated circuit interconnections</subject><subject>interconnect architectures</subject><subject>Latches</subject><subject>leakage</subject><subject>Metals</subject><subject>Microprocessors</subject><subject>multiprocessors</subject><subject>power</subject><subject>Power consumption</subject><subject>ring</subject><subject>Switches</subject><subject>Switching</subject><subject>Timing</subject><subject>Wire</subject><issn>1549-8328</issn><issn>1558-0806</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkE9LAzEQxRdRsFY_gHhZPHno6iSbP7veylK1ULFgvXgJ2XQCW9qkJlvEb29KiwdPM2_m94bhZdk1gXtCoH5YNO_TewpJUpBlVdKTbEA4rwqoQJzue1YXaVydZxcxrgBoDSUZZJ_jvPGxLybWdqZD1-czUsxo_rpb953xAfOp6zEY7xya_jGfY7A-bLQzOMrn_hvDKNdumY8D6nTJxW6JQfdd6i6zM6vXEa-OdZh9PE0WzUsxe3ueNuNZYSjnfaGZBSglMCGtaI3RutQ1MpSESSBta1ohjGyrJQdqBSRptWmhNYwvOdK2HGZ3h7vb4L92GHu16aLB9Vo79LuoiJCE0opXPKG3_9CV3wWXvlNpWwlW12WCyAEywccY0Kpt6DY6_CgCah-22oet9mGrY9jJc3PwdIj4x3PBmKSy_AVPdXon</recordid><startdate>201103</startdate><enddate>201103</enddate><creator>Golander, Amit</creator><creator>Levison, Nadav</creator><creator>Heymann, Omer</creator><creator>Briskman, Alexander</creator><creator>Wolski, Mark J</creator><creator>Robinson, Eric F</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>201103</creationdate><title>A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations</title><author>Golander, Amit ; Levison, Nadav ; Heymann, Omer ; Briskman, Alexander ; Wolski, Mark J ; Robinson, Eric F</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c255t-a4f00370467f6bccaa3a9e4e714701bbcb66c7b8d502f60cb6facb0bc45d5e2b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Arbitration</topic><topic>Chip multiprocessor (CMP)</topic><topic>Circuits</topic><topic>Clocks</topic><topic>Clusters</topic><topic>computer architecture</topic><topic>Consumption</topic><topic>Hierarchies</topic><topic>Integrated circuit interconnections</topic><topic>interconnect architectures</topic><topic>Latches</topic><topic>leakage</topic><topic>Metals</topic><topic>Microprocessors</topic><topic>multiprocessors</topic><topic>power</topic><topic>Power consumption</topic><topic>ring</topic><topic>Switches</topic><topic>Switching</topic><topic>Timing</topic><topic>Wire</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Golander, Amit</creatorcontrib><creatorcontrib>Levison, Nadav</creatorcontrib><creatorcontrib>Heymann, Omer</creatorcontrib><creatorcontrib>Briskman, Alexander</creatorcontrib><creatorcontrib>Wolski, Mark J</creatorcontrib><creatorcontrib>Robinson, Eric F</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on circuits and systems. I, Regular papers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Golander, Amit</au><au>Levison, Nadav</au><au>Heymann, Omer</au><au>Briskman, Alexander</au><au>Wolski, Mark J</au><au>Robinson, Eric F</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations</atitle><jtitle>IEEE transactions on circuits and systems. I, Regular papers</jtitle><stitle>TCSI</stitle><date>2011-03</date><risdate>2011</risdate><volume>58</volume><issue>3</issue><spage>529</spage><epage>538</epage><pages>529-538</pages><issn>1549-8328</issn><eissn>1558-0806</eissn><coden>ITCSCH</coden><abstract>Processor manufacturers use advances in manufacturing technologies to increase the number of cores on chip in order to scale performance in a cost-efficient manner. As the number of cores scales up, not all cores can be directly connected to the main memory and there is a need for hierarchy, for example, by arranging them in clusters that share L2 caches. This paper focuses on designing cost-efficient L1-L2 interconnects. We discuss performance and power- and area-consumption considerations for a real processor designed in 45-nm technology. We explain the architectures and heuristics developed, including a smart floorplan with instance flips to address interconnect latency, customized decentralized arbitration schemes tailored per transaction type, and heterogeneous Vt device assignment to reduce overall power consumption, taking into account the expected switching factors. These and other methods worked together to achieve high throughput in a power-efficient interconnect that consumes less than 3% of the compute cluster area.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCSI.2010.2073832</doi><tpages>10</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1549-8328 |
ispartof | IEEE transactions on circuits and systems. I, Regular papers, 2011-03, Vol.58 (3), p.529-538 |
issn | 1549-8328 1558-0806 |
language | eng |
recordid | cdi_ieee_primary_5644727 |
source | IEEE Electronic Library (IEL) |
subjects | Arbitration Chip multiprocessor (CMP) Circuits Clocks Clusters computer architecture Consumption Hierarchies Integrated circuit interconnections interconnect architectures Latches leakage Metals Microprocessors multiprocessors power Power consumption ring Switches Switching Timing Wire |
title | A Cost-Efficient L1-L2 Multicore Interconnect: Performance, Power, and Area Considerations |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T06%3A26%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20Cost-Efficient%20L1-L2%20Multicore%20Interconnect:%20Performance,%20Power,%20and%20Area%20Considerations&rft.jtitle=IEEE%20transactions%20on%20circuits%20and%20systems.%20I,%20Regular%20papers&rft.au=Golander,%20Amit&rft.date=2011-03&rft.volume=58&rft.issue=3&rft.spage=529&rft.epage=538&rft.pages=529-538&rft.issn=1549-8328&rft.eissn=1558-0806&rft.coden=ITCSCH&rft_id=info:doi/10.1109/TCSI.2010.2073832&rft_dat=%3Cproquest_RIE%3E1671228585%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=853864993&rft_id=info:pmid/&rft_ieee_id=5644727&rfr_iscdi=true |