Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature
We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100 ° C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for...
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| Veröffentlicht in: | IEEE transactions on components and packaging technologies 2010-12, Vol.33 (4), p.809-818 |
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| container_title | IEEE transactions on components and packaging technologies |
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| creator | Changsoo Jang Bongtae Han Yoon, Samson |
| description | We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100 ° C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process. |
| doi_str_mv | 10.1109/TCAPT.2010.2063430 |
| format | Article |
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The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2010.2063430</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Absorption ; Desorption ; Diffusion ; Diffusion processes ; Diffusion property ; Diffusivity ; Moisture ; moisture diffusion ; Molding compounds ; Numerical simulation ; Packaging ; Polymers ; reflow process ; Solders ; Solubility ; Temperature</subject><ispartof>IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.809-818</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Dec 2010</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c392t-ea290ce592d929c5eeff6560898ec07ca647d12feb5f4ee59a2a21279e7a02993</citedby><cites>FETCH-LOGICAL-c392t-ea290ce592d929c5eeff6560898ec07ca647d12feb5f4ee59a2a21279e7a02993</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5643120$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27923,27924,54757</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5643120$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Changsoo Jang</creatorcontrib><creatorcontrib>Bongtae Han</creatorcontrib><creatorcontrib>Yoon, Samson</creatorcontrib><title>Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100 ° C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.</description><subject>Absorption</subject><subject>Desorption</subject><subject>Diffusion</subject><subject>Diffusion processes</subject><subject>Diffusion property</subject><subject>Diffusivity</subject><subject>Moisture</subject><subject>moisture diffusion</subject><subject>Molding compounds</subject><subject>Numerical simulation</subject><subject>Packaging</subject><subject>Polymers</subject><subject>reflow process</subject><subject>Solders</subject><subject>Solubility</subject><subject>Temperature</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkUtLxDAUhYsoOD7-gG6CG1fVPJq2WUodHzCiaF2HmN5ohk5Tk1adf2_qiAtX9_Wdw4WTJEcEnxGCxXldXTzUZxTHmeKcZQxvJTPCeZEKUdDtqackZYyR3WQvhCXGJCszMUt85Va9hzfogv0AdOdsGEYP6NIaMwbrOlS9Ka_0AD5erA7IGTTv3dc6sm1ju1c0ObixawK6_wCPnuI6lkcwrftED95pCAHVsOrBq8n7INkxqg1w-Fv3k-ereV3dpIv769vqYpFqJuiQgqICa-CCNoIKzQGMyXmOS1GCxoVWeVY0hBp44SaDyCmqKKGFgEJhKgTbT043vr137yOEQa5s0NC2qgM3BlnmhGeUCRbJk3_k0o2-i8_JkhVZIXieR4huIO1dCB6M7L1dKb-WBMspBPkTgpxCkL8hRNHxRmQB4E_A84wRitk3nPiFGA</recordid><startdate>201012</startdate><enddate>201012</enddate><creator>Changsoo Jang</creator><creator>Bongtae Han</creator><creator>Yoon, Samson</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>201012</creationdate><title>Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature</title><author>Changsoo Jang ; Bongtae Han ; Yoon, Samson</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c392t-ea290ce592d929c5eeff6560898ec07ca647d12feb5f4ee59a2a21279e7a02993</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Absorption</topic><topic>Desorption</topic><topic>Diffusion</topic><topic>Diffusion processes</topic><topic>Diffusion property</topic><topic>Diffusivity</topic><topic>Moisture</topic><topic>moisture diffusion</topic><topic>Molding compounds</topic><topic>Numerical simulation</topic><topic>Packaging</topic><topic>Polymers</topic><topic>reflow process</topic><topic>Solders</topic><topic>Solubility</topic><topic>Temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Changsoo Jang</creatorcontrib><creatorcontrib>Bongtae Han</creatorcontrib><creatorcontrib>Yoon, Samson</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Changsoo Jang</au><au>Bongtae Han</au><au>Yoon, Samson</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2010-12</date><risdate>2010</risdate><volume>33</volume><issue>4</issue><spage>809</spage><epage>818</epage><pages>809-818</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100 ° C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2010.2063430</doi><tpages>10</tpages></addata></record> |
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| ispartof | IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.809-818 |
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| source | IEEE Electronic Library (IEL) |
| subjects | Absorption Desorption Diffusion Diffusion processes Diffusion property Diffusivity Moisture moisture diffusion Molding compounds Numerical simulation Packaging Polymers reflow process Solders Solubility Temperature |
| title | Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature |
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