Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter

The further miniaturization of electronic packages is driven by a large variety of applications with high requirements on pitch and form factor. This will be conducive to higher I/O-counts and a reduction of the solder bump size. In this work, new cost-efficient solder bumping and adapted assembly t...

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Bibliographische Detailangaben

Hauptverfasser:	Dohle, Rainer, Schüssler, Florian, Friedrich, Thomas, Gossler, Jörg, Oppert, Thomas, Franke, Jörg
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Ceramics Layout Reliability Soldering Substrates
Online-Zugang:	Volltext bestellen
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