Interaction between post wire saw cleaning and the subsequent cell fabrication saw damage etch and texturing process

Post wire saw wafers presented for cleaning are heavily contaminated with cutting fluid slurry, silicon kerf, trace metallic species and oxides. There is no industry standard process or equipment set for this operation with various options utilised by the wafer manufacturer. However a common theme i...

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Bibliographische Detailangaben

Hauptverfasser:	Allardyce, George, Barr, Robert, Chan, Raymond, Moynihan, Matt, O'Connor, Corey, Ridler, Tony
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Reflectivity Silicon Surface cleaning Surface texture Surface topography
Online-Zugang:	Volltext bestellen
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