Exploiting power budgeting in thermal-aware dynamic placement for reconfigurable systems
In this paper, a novel thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving time-consuming differential equations to obtain the hotspots, we propose a fast and accurate heuristic model based on power budge...
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| creator | Golshan, Shahin Bozorgzadeh, Eli Schafer, Benjamin C. Wakabayashi, Kazutoshi Homayoun, Houman Veidenbaum, Alex |
| description | In this paper, a novel thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving time-consuming differential equations to obtain the hotspots, we propose a fast and accurate heuristic model based on power budgeting to plan the dynamic placements of the design statically, while considering the boundary conditions. Based on our heuristic model, we have developed a fast optimization technique to plan the dynamic placements at design time. Our results indicate that our technique is two orders of magnitude faster while the quality of the placements generated in terms of temperature and interconnection overhead is the same, if not better, compared to the thermal-aware placement techniques which perform thermal simulations inside the search engine. |
| doi_str_mv | 10.1145/1840845.1840856 |
| format | Conference Proceeding |
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| identifier | ISBN: 1450301460 |
| ispartof | 2010 ACM/IEEE International Symposium on Low-Power Electronics and Design (ISLPED), 2010, p.49-54 |
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| language | eng |
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| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Applied computing -- Arts and humanities -- Architecture (buildings) -- Computer-aided design Applied computing -- Physical sciences and engineering -- Engineering -- Computer-aided design Computer Aided Design Dynamic Reconfiguration Equations Finite element methods Mathematical model Optimization Placement Reconfigurable Systems Temperature Temperature sensors Transient analysis Wire |
| title | Exploiting power budgeting in thermal-aware dynamic placement for reconfigurable systems |
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