An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography

This paper describes the application of several imaging technologies available at the Center for solder joint inspection. X-ray laminography was combined with artificial neural networks to classify solder joints. Components with ball grid array, gull-wing and J-lead joints were imaged and several ne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kalukin, A.R., Sankaran, V., Chartrand, B., Millard, D.L., Kraft, R.P., Embrechts, M.J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Artificial neural networks Backpropagation Electronics packaging Image classification Image reconstruction Inspection Optical imaging Shape Soldering X-ray imaging
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