Developing an underfill process for dense flip chip applications

HP's current generation workstation processor uses flip chip on ceramic technology to help achieve increased clock speeds and higher I/O count. Due to the large die size, underfill is needed to improve the fatigue life of the flip chip solder connections. The processor package offers limited ac...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Leong, W.H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Ceramics Clocks Curing Fatigue Flip chip Material properties Packaging Temperature Thermal expansion Thermal stresses
Online-Zugang:	Volltext bestellen
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