Adhesion issued in epoxy-based chip attach adhesives

This paper focuses on the effects of surface chemistry and processing conditions on the adhesive strength of epoxy-based chip attach adhesives on typical leadframe substrates. The surface chemistry is characterized using a three liquid probe method, which quantifies the polar and apolar contribution...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology. Part A packaging, and manufacturing technology. Part A, 1997-03, Vol.20 (1), p.31-37
Hauptverfasser:	Pearson, R.A., Lloyd, T.B., Azimi, H.R., Hsiung, J.-C., Early, M.S., Brandenburger, P.D.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesives Bonding Chemistry Delamination Electronics packaging Lead Moisture Plastic packaging Surface cracks Temperature
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