A study to performance of electroplating solder bump in assembly

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Mu-Chun Wang, Kuo-Shu Huang, Zhen-Ying Hsieh, Hsin-Chia Yang, Chuan-Hsi Liu, Chii-Ruey Lin
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Gold Materials Packaging Passivation Printing
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