Delamination study on SOIC L/F with high thermal conductivity die attach paste

In this paper, a high thermal die attach paste with 90% Ag filler content was evaluated on copper SOIC L/F, but a flag delamination around die was found after MSL3@260C; in contrary, control paste (non-high thermal) didn't show any delamination around die. By comparing high thermal paste and co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Xingshou Pang, Xu, Nathan, Sheila, Chopin, Jinzhong Yao
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Conductivity Copper Delamination Electronic packaging thermal management Lead Solvents Thermal conductivity
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