Design-technology interaction for post-32 nm node CMOS technologies

This paper will review the technology features in the recent and upcoming nodes and how they will impact circuit design, product performance, and migratability. It will cover the challenges and serious limitations that we will face in FEOL (increased leakage, loss of body effect), BEOL (RC, electro-...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Shahidi, G G
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Cooling Immune system Lithography Logic gates Materials Metallization Performance evaluation
Online-Zugang:	Volltext bestellen
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