Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC

The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickne...

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Veröffentlicht in:	IEEE transactions on nuclear science 2010-10, Vol.57 (5), p.2897-2905
Hauptverfasser:	Koybasi, O, Bortoletto, D, Hansen, T, Kok, A, Hansen, T A, Lietaer, N, Jensen, G U, Summanwar, A, Bolla, G, Kwan, Simon Wing Lok
Format:	Artikel
Sprache:	eng
Schlagworte:	3D silicon pixel detectors Beams (radiation) Charge carrier processes CMS DESIGN Detectors Devices ELECTRODES FABRICATION HARDNESS Instrumentation INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY LEAKAGE CURRENT Pixel Pixels radiation hardness RADIATIONS Silicon SIMULATION SUBSTRATES super-LHC THICKNESS Three dimensional Three dimensional displays Tracking
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