Leveraging blanket wafer film inspection to efficiently characterize root cause for lithographic micro-masking patterning defects

This paper presents a methodology that uses unpatterned wafer inspection to detect material-related micro-masking defects in a tri-layer stack. We investigated two approaches to detect the source of the micro-masking defect, namely (i) defect source analysis (DSA) comparing patterned-wafer inspectio...

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Hauptverfasser: Ramaswamy, S, Yathapu, N, Lembach, G, Guse, M, Linnane, M
Format: Tagungsbericht
Sprache:eng
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