Leveraging blanket wafer film inspection to efficiently characterize root cause for lithographic micro-masking patterning defects
This paper presents a methodology that uses unpatterned wafer inspection to detect material-related micro-masking defects in a tri-layer stack. We investigated two approaches to detect the source of the micro-masking defect, namely (i) defect source analysis (DSA) comparing patterned-wafer inspectio...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!