Investigating the increment of deposited solder paste due to uneven PCB Surface

The level differences on the PCBs' surface can keep the stencil away from the PCB during stencil printing, which causes large deposited solder paste volume, and can result in solder bridges after reflow soldering. The level differences can be caused by identity decals, or by other artifacts on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Krammer, O, Molnar, L M, Jakab, L, Klein, C
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Apertures Bridges Copper Printing Reflow soldering Springs
Online-Zugang:	Volltext bestellen
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