Optoelectronic multichip modules based on microoptoelectromechanical system fabrication techniques

The improvements of communication delay and connectivity by optical interconnection links and multichip module packaging indicate that optoelectronic multichip modules (OE-MCMs) utilizing both technologies will appear in computer systems and communication networks in the near future. However OE-MCM...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Seungug Koh, Ahn, C.H., Garter, H.J., Sadler, D.J., Cook, A.L.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Availability Communication networks Computer networks Electronics packaging Multichip modules Multiprocessor interconnection networks Optical computing Optical device fabrication Optical interconnections Photonic integrated circuits
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