Heterogeneous flip-chip assembly of a GaAs C-band power amplifier MMIC using liquid metal vertical interconnects

A new process utilizing room temperature liquid metals as interconnect material for flip chip assembly of active circuits has been demonstrated. These interconnects form flexible bonds between chips of heterogeneous materials and therefore flip clip assembly built with this configuration is not susc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ralston, P. E., Wood, J., Vummidi, K., Oliver, J. M., Raman, S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Active circuits Assembly Flip chip Gallium arsenide Inorganic materials Integrated circuit interconnections MMICs Power amplifiers Temperature Thermomechanical processes
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