Apply genetic algorithm to minimize the overkills in wafer probe testing

In this paper, an ordinal optimization (OO) based algorithm is applied to minimize the overkills under a tolerable level of re-probes in a wafer probe testing process, which is formulated as a constrained stochastic simulation optimization problem that consists of a huge input-variable space formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shih-Cheng Horng, Han-Tang Tsou
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chaos Circuit testing Computer science Constraint optimization genetic algorithm Genetic algorithms Manufacturing processes ordinal optimization overkill Probes re-probe Space technology Stochastic processes Throughput wafer probe testing
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