Interconnection via technology and wafer level package for crystal unit device

Most important technology for developing of wafer level packaging is studied in this paper. That is the process of drilling the via hole that are needed filling of conductive material for electrical connection or non-conductive material for reliability. Several kinds of drilling and filling methods...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tae Hoon Kim, Jong Yeol Jeon, Yun Pyo Kwak, Tae Ho Kim, Yun Jung Lim, Jang Ho Park, Seog Moon Choi, Sung Yi
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Conducting materials Cost function Crystalline materials Design optimization Drilling Filling Glass Materials reliability Packaging Wafer scale integration
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