WLCSP and Flip Chip bumping technologies

WLCSP bumps have traditionally been produced by dropping preformed solder spheres through a metal template onto silicon wafers using modified surface mount stencil printers. The squeegee blades associated with these printers have been retrofitted with a special fixture in which spheres are gravity f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Oppert, Thomas, Azdasht, Ghassem, Zakel, Elke
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Closed loop systems Electroless Nickel Fixtures Flip chip Gang Ball Placement Nickel Printers Printing Semiconductor device measurement Semiconductor device packaging Solder Ball Transfer Solder Sphere Vacuum technology WLCSP
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