Development of rigid-flex and multilayer flex for electronic packaging

Recent development work on flex joining using different pre-pregs is highlighted, particularly with respect to their integration in laminate chip carrier substrates, and the reliability of the joints formed between the rigid and flex surfaces. A variety of rigid-flex structures were fabricated, with...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Das, Rabindra N, Egitto, Frank D, Wilson, Bill, Poliks, Mark D, Markovich, Voya R
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Dielectric substrates Electric shock Electronics packaging Fabrication Failure analysis Laminates Nonhomogeneous media Optical microscopy Polyimides Wiring
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!