Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects

We report here on the design, fabrication and characterization of highly-integrated 3-D Optochips consisting of a Si carrier platform with 4 flip-chip attached components: two 24-channel 850-nm optoelectronic (OE) arrays (VCSELs and photodiodes) and two 24-channel CMOS ICs (receivers and laser drive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Doany, Fuad E, Lee, Benjamin G, Schow, Clint L, Tsang, Cornelia K, Baks, Christian, Kwark, Young, John, Richard, Knickerbocker, John U, Kash, Jeffrey A
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding High speed optical techniques Optical arrays Optical interconnections Optical receivers Optical transmitters Photodiodes Through-silicon vias Transceivers Vertical cavity surface emitting lasers
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