A package demonstration with solder free compliant flexible interconnects

Flexible, stress-engineered spring interconnects are a novel technology potentially enabling room temperature assembly approaches to building highly integrated and multi-chip modules (MCMs). Such interconnects are an essential solder-free technology facilitating the MCM package diagnostics and rewor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shubin, I, Chow, A, Cunningham, J, Giere, M, Nettleton, N, Pinckney, N, Shi, J, Simons, J, Hopkins, R, Mitchell, J, Douglas, D, Chow, E M, DeBruyker, D, Cheng, B, Anderson, G
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Ceramics Electronics packaging Integrated circuit interconnections Integrated circuit packaging Metrology Silicon Springs Substrates Temperature
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