The experimental and numerical investigation on shear behaviour of solder ball in a wafer level chip scale package

The shear test under high strain rate is becoming a popular approach to investigate the fracture behaviour of a thermally attached solder ball under different strain rates. However, despite a substantial number of experimental tests being conducted recently, only a few numerical simulation works hav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ye Zhang, Yangjian Xu, Yong Liu, Schoenberg, Andrew
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Chip scale packaging Computational modeling Conducting materials High performance computing Numerical simulation Performance analysis Soldering Testing Wafer scale integration
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