Improved electrochemical etching for the formation of 3D p-n junction

3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D struc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jing Shi, Pengliang Ci, Fei Wang, Huayan Zhang, Lianwei Wang
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 4
container_issue
container_start_page 1
container_title
container_volume
creator Jing Shi
Pengliang Ci
Fei Wang
Huayan Zhang
Lianwei Wang
description 3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D structure for p-n junction. However, the thickness of sidewall between two adjacent pores in the structure is usually too thin for p-type silicon to accord with technological requirement of following diffusion. In this report, pulse current was employed to manufacture satisfactory microstructure p-type silicon with thick sidewall. The 3D p-n junction based on this novel structure is promising for application in photovoltaic energy conversion and detection.
doi_str_mv 10.1109/IWJT.2010.5474908
format Conference Proceeding
fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5474908</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5474908</ieee_id><sourcerecordid>5474908</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-1c92c828722da934c51a241ca421fe3c5e2b22c0f0470042fe8441c7f76051283</originalsourceid><addsrcrecordid>eNpFT01Lw0AUXBFBrf0B4mX_QOruy9tk9yi1aqTgJeCxrK9vzZZ8kUTBf2-KBecyzAwMM0LcarXSWrn74v21XIGapcEcnbJn4lojIBqbOTj_F5m9FMtxPKgZaEAreyU2RdMP3TfvJddM09BRxU0kX0ueqIrtpwzdIKeKj9z4KXat7IJMH2WftPLw1dLRuhEXwdcjL0-8EOXTply_JNu352L9sE2iU1OiyQFZsDnA3rsUyWgPqMkj6MApGYYPAFJBYT4vhMAW5zgPeaaMBpsuxN1fbWTmXT_Exg8_u9Pr9Bc9MEoH</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Improved electrochemical etching for the formation of 3D p-n junction</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Jing Shi ; Pengliang Ci ; Fei Wang ; Huayan Zhang ; Lianwei Wang</creator><creatorcontrib>Jing Shi ; Pengliang Ci ; Fei Wang ; Huayan Zhang ; Lianwei Wang</creatorcontrib><description>3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D structure for p-n junction. However, the thickness of sidewall between two adjacent pores in the structure is usually too thin for p-type silicon to accord with technological requirement of following diffusion. In this report, pulse current was employed to manufacture satisfactory microstructure p-type silicon with thick sidewall. The 3D p-n junction based on this novel structure is promising for application in photovoltaic energy conversion and detection.</description><identifier>ISBN: 1424458668</identifier><identifier>ISBN: 9781424458660</identifier><identifier>EISBN: 1424458692</identifier><identifier>EISBN: 9781424458684</identifier><identifier>EISBN: 9781424458691</identifier><identifier>EISBN: 1424458684</identifier><identifier>DOI: 10.1109/IWJT.2010.5474908</identifier><language>eng</language><publisher>IEEE</publisher><subject>Detectors ; Energy conversion ; Etching ; Manufacturing ; Materials testing ; Microstructure ; P-n junctions ; Photovoltaic systems ; Silicon ; Solar power generation</subject><ispartof>2010 International Workshop on Junction Technology Extended Abstracts, 2010, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5474908$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5474908$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Jing Shi</creatorcontrib><creatorcontrib>Pengliang Ci</creatorcontrib><creatorcontrib>Fei Wang</creatorcontrib><creatorcontrib>Huayan Zhang</creatorcontrib><creatorcontrib>Lianwei Wang</creatorcontrib><title>Improved electrochemical etching for the formation of 3D p-n junction</title><title>2010 International Workshop on Junction Technology Extended Abstracts</title><addtitle>IWJT</addtitle><description>3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D structure for p-n junction. However, the thickness of sidewall between two adjacent pores in the structure is usually too thin for p-type silicon to accord with technological requirement of following diffusion. In this report, pulse current was employed to manufacture satisfactory microstructure p-type silicon with thick sidewall. The 3D p-n junction based on this novel structure is promising for application in photovoltaic energy conversion and detection.</description><subject>Detectors</subject><subject>Energy conversion</subject><subject>Etching</subject><subject>Manufacturing</subject><subject>Materials testing</subject><subject>Microstructure</subject><subject>P-n junctions</subject><subject>Photovoltaic systems</subject><subject>Silicon</subject><subject>Solar power generation</subject><isbn>1424458668</isbn><isbn>9781424458660</isbn><isbn>1424458692</isbn><isbn>9781424458684</isbn><isbn>9781424458691</isbn><isbn>1424458684</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFT01Lw0AUXBFBrf0B4mX_QOruy9tk9yi1aqTgJeCxrK9vzZZ8kUTBf2-KBecyzAwMM0LcarXSWrn74v21XIGapcEcnbJn4lojIBqbOTj_F5m9FMtxPKgZaEAreyU2RdMP3TfvJddM09BRxU0kX0ueqIrtpwzdIKeKj9z4KXat7IJMH2WftPLw1dLRuhEXwdcjL0-8EOXTply_JNu352L9sE2iU1OiyQFZsDnA3rsUyWgPqMkj6MApGYYPAFJBYT4vhMAW5zgPeaaMBpsuxN1fbWTmXT_Exg8_u9Pr9Bc9MEoH</recordid><startdate>201005</startdate><enddate>201005</enddate><creator>Jing Shi</creator><creator>Pengliang Ci</creator><creator>Fei Wang</creator><creator>Huayan Zhang</creator><creator>Lianwei Wang</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201005</creationdate><title>Improved electrochemical etching for the formation of 3D p-n junction</title><author>Jing Shi ; Pengliang Ci ; Fei Wang ; Huayan Zhang ; Lianwei Wang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-1c92c828722da934c51a241ca421fe3c5e2b22c0f0470042fe8441c7f76051283</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Detectors</topic><topic>Energy conversion</topic><topic>Etching</topic><topic>Manufacturing</topic><topic>Materials testing</topic><topic>Microstructure</topic><topic>P-n junctions</topic><topic>Photovoltaic systems</topic><topic>Silicon</topic><topic>Solar power generation</topic><toplevel>online_resources</toplevel><creatorcontrib>Jing Shi</creatorcontrib><creatorcontrib>Pengliang Ci</creatorcontrib><creatorcontrib>Fei Wang</creatorcontrib><creatorcontrib>Huayan Zhang</creatorcontrib><creatorcontrib>Lianwei Wang</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jing Shi</au><au>Pengliang Ci</au><au>Fei Wang</au><au>Huayan Zhang</au><au>Lianwei Wang</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Improved electrochemical etching for the formation of 3D p-n junction</atitle><btitle>2010 International Workshop on Junction Technology Extended Abstracts</btitle><stitle>IWJT</stitle><date>2010-05</date><risdate>2010</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><isbn>1424458668</isbn><isbn>9781424458660</isbn><eisbn>1424458692</eisbn><eisbn>9781424458684</eisbn><eisbn>9781424458691</eisbn><eisbn>1424458684</eisbn><abstract>3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D structure for p-n junction. However, the thickness of sidewall between two adjacent pores in the structure is usually too thin for p-type silicon to accord with technological requirement of following diffusion. In this report, pulse current was employed to manufacture satisfactory microstructure p-type silicon with thick sidewall. The 3D p-n junction based on this novel structure is promising for application in photovoltaic energy conversion and detection.</abstract><pub>IEEE</pub><doi>10.1109/IWJT.2010.5474908</doi><tpages>4</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISBN: 1424458668
ispartof 2010 International Workshop on Junction Technology Extended Abstracts, 2010, p.1-4
issn
language eng
recordid cdi_ieee_primary_5474908
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Detectors
Energy conversion
Etching
Manufacturing
Materials testing
Microstructure
P-n junctions
Photovoltaic systems
Silicon
Solar power generation
title Improved electrochemical etching for the formation of 3D p-n junction
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T11%3A36%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Improved%20electrochemical%20etching%20for%20the%20formation%20of%203D%20p-n%20junction&rft.btitle=2010%20International%20Workshop%20on%20Junction%20Technology%20Extended%20Abstracts&rft.au=Jing%20Shi&rft.date=2010-05&rft.spage=1&rft.epage=4&rft.pages=1-4&rft.isbn=1424458668&rft.isbn_list=9781424458660&rft_id=info:doi/10.1109/IWJT.2010.5474908&rft_dat=%3Cieee_6IE%3E5474908%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424458692&rft.eisbn_list=9781424458684&rft.eisbn_list=9781424458691&rft.eisbn_list=1424458684&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5474908&rfr_iscdi=true