Crack and damage in low-k BEoL stacks under assembly and CPI aspects

Miniaturization and increasing functional integration as the electronic industry drives push the development of feature sizes down to the nanometer range. Moreover, harsh operational conditions and new porous or nano-particle filled materials introduced on both chip and package level - low-k and ult...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly CMOS technology Electronics industry Electronics packaging Environmentally friendly manufacturing techniques Fatigue Materials reliability Nanostructured materials Residual stresses Virtual manufacturing
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