Thermal analysis and verification of a mounted monolithic integrated circuit

As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validatio...

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Hauptverfasser: Harris, T Robert, Melamed, Samson, Luniya, Sonali, Davis, W Rhett, Steer, Michael B, Doxsee, Lawrence E, Obermiller, Kurt, Hawkinson, Chad
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creator Harris, T Robert
Melamed, Samson
Luniya, Sonali
Davis, W Rhett
Steer, Michael B
Doxsee, Lawrence E
Obermiller, Kurt
Hawkinson, Chad
description As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution are problematic. As such, the thermal profile of integrated circuits cannot be measured directly with infrared thermal imaging due to unequivalent emissivities of materials. It becomes necessary to use an absorptive ink to approximate a blackbody so that the infrared emissions can be used to infer temperature. The impact and effect of this thermal imaging technique is investigated in this work by comparing measurements with detailed thermal simulations with and without the surface treatment. Thermal analysis uses the finite element method and a reduced-order model based on cuboids with effective thermal conductivities. The end goal is to provide a simulation tool to designers, which can be extended to any project which requires attention to thermal preference.
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5453924</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5453924</ieee_id><sourcerecordid>5453924</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-be94560ff865f3dd54e00a8ce52b51e5698b7ee8e02de0c3887cbd444f372ded3</originalsourceid><addsrcrecordid>eNo1kM1OwzAQhM1PJUrpC8AlL5CyjncT54iqFpAqeqBI3CrHXlOjNEFJitS3x4iyl9n5RlppR4hbCTMpobx_XczXL7MMoickVWZ4JqZloSVmiKRJwbkYSyKdAun3C3H9HyBexgBKmQIQjMRYY5qjUkV2JaZ9_wlxkIAIxmK12XG3N3ViGlMf-9DHxSXf3AUfrBlC2yStT0yybw_NwC5q09Zh2AWbhAg-OvNLbejsIQw3YuRN3fP0pBPxtlxs5k_pav34PH9YpUEWNKQVl0g5eK9z8so5QgYw2jJlFUmmvNRVwawZMsdgldaFrRwi-viCY6cm4u7vbmDm7VcX9qY7bk8lqR-xS1Xx</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Thermal analysis and verification of a mounted monolithic integrated circuit</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Harris, T Robert ; Melamed, Samson ; Luniya, Sonali ; Davis, W Rhett ; Steer, Michael B ; Doxsee, Lawrence E ; Obermiller, Kurt ; Hawkinson, Chad</creator><creatorcontrib>Harris, T Robert ; Melamed, Samson ; Luniya, Sonali ; Davis, W Rhett ; Steer, Michael B ; Doxsee, Lawrence E ; Obermiller, Kurt ; Hawkinson, Chad</creatorcontrib><description>As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution are problematic. As such, the thermal profile of integrated circuits cannot be measured directly with infrared thermal imaging due to unequivalent emissivities of materials. It becomes necessary to use an absorptive ink to approximate a blackbody so that the infrared emissions can be used to infer temperature. The impact and effect of this thermal imaging technique is investigated in this work by comparing measurements with detailed thermal simulations with and without the surface treatment. Thermal analysis uses the finite element method and a reduced-order model based on cuboids with effective thermal conductivities. The end goal is to provide a simulation tool to designers, which can be extended to any project which requires attention to thermal preference.</description><identifier>ISSN: 1091-0050</identifier><identifier>ISBN: 1424458544</identifier><identifier>ISBN: 9781424458547</identifier><identifier>EISSN: 1558-058X</identifier><identifier>EISBN: 9781424458530</identifier><identifier>EISBN: 1424458536</identifier><identifier>EISBN: 1424458552</identifier><identifier>EISBN: 9781424458554</identifier><identifier>DOI: 10.1109/SECON.2010.5453924</identifier><identifier>LCCN: 84-643372</identifier><language>eng</language><publisher>IEEE</publisher><subject>Circuit simulation ; compact modeling ; electrothermal ; fREEDA ; heat transfer ; Integrated circuit measurements ; Integrated circuit modeling ; Microwave integrated circuits ; Microwave measurements ; MMIC ; MMICs ; Monolithic integrated circuits ; Optical imaging ; Power measurement ; simulators ; Thermal conductivity</subject><ispartof>Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon), 2010, p.37-40</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5453924$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5453924$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Harris, T Robert</creatorcontrib><creatorcontrib>Melamed, Samson</creatorcontrib><creatorcontrib>Luniya, Sonali</creatorcontrib><creatorcontrib>Davis, W Rhett</creatorcontrib><creatorcontrib>Steer, Michael B</creatorcontrib><creatorcontrib>Doxsee, Lawrence E</creatorcontrib><creatorcontrib>Obermiller, Kurt</creatorcontrib><creatorcontrib>Hawkinson, Chad</creatorcontrib><title>Thermal analysis and verification of a mounted monolithic integrated circuit</title><title>Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon)</title><addtitle>SECON</addtitle><description>As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution are problematic. As such, the thermal profile of integrated circuits cannot be measured directly with infrared thermal imaging due to unequivalent emissivities of materials. It becomes necessary to use an absorptive ink to approximate a blackbody so that the infrared emissions can be used to infer temperature. The impact and effect of this thermal imaging technique is investigated in this work by comparing measurements with detailed thermal simulations with and without the surface treatment. Thermal analysis uses the finite element method and a reduced-order model based on cuboids with effective thermal conductivities. The end goal is to provide a simulation tool to designers, which can be extended to any project which requires attention to thermal preference.</description><subject>Circuit simulation</subject><subject>compact modeling</subject><subject>electrothermal</subject><subject>fREEDA</subject><subject>heat transfer</subject><subject>Integrated circuit measurements</subject><subject>Integrated circuit modeling</subject><subject>Microwave integrated circuits</subject><subject>Microwave measurements</subject><subject>MMIC</subject><subject>MMICs</subject><subject>Monolithic integrated circuits</subject><subject>Optical imaging</subject><subject>Power measurement</subject><subject>simulators</subject><subject>Thermal conductivity</subject><issn>1091-0050</issn><issn>1558-058X</issn><isbn>1424458544</isbn><isbn>9781424458547</isbn><isbn>9781424458530</isbn><isbn>1424458536</isbn><isbn>1424458552</isbn><isbn>9781424458554</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1kM1OwzAQhM1PJUrpC8AlL5CyjncT54iqFpAqeqBI3CrHXlOjNEFJitS3x4iyl9n5RlppR4hbCTMpobx_XczXL7MMoickVWZ4JqZloSVmiKRJwbkYSyKdAun3C3H9HyBexgBKmQIQjMRYY5qjUkV2JaZ9_wlxkIAIxmK12XG3N3ViGlMf-9DHxSXf3AUfrBlC2yStT0yybw_NwC5q09Zh2AWbhAg-OvNLbejsIQw3YuRN3fP0pBPxtlxs5k_pav34PH9YpUEWNKQVl0g5eK9z8so5QgYw2jJlFUmmvNRVwawZMsdgldaFrRwi-viCY6cm4u7vbmDm7VcX9qY7bk8lqR-xS1Xx</recordid><startdate>201003</startdate><enddate>201003</enddate><creator>Harris, T Robert</creator><creator>Melamed, Samson</creator><creator>Luniya, Sonali</creator><creator>Davis, W Rhett</creator><creator>Steer, Michael B</creator><creator>Doxsee, Lawrence E</creator><creator>Obermiller, Kurt</creator><creator>Hawkinson, Chad</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201003</creationdate><title>Thermal analysis and verification of a mounted monolithic integrated circuit</title><author>Harris, T Robert ; Melamed, Samson ; Luniya, Sonali ; Davis, W Rhett ; Steer, Michael B ; Doxsee, Lawrence E ; Obermiller, Kurt ; Hawkinson, Chad</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-be94560ff865f3dd54e00a8ce52b51e5698b7ee8e02de0c3887cbd444f372ded3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Circuit simulation</topic><topic>compact modeling</topic><topic>electrothermal</topic><topic>fREEDA</topic><topic>heat transfer</topic><topic>Integrated circuit measurements</topic><topic>Integrated circuit modeling</topic><topic>Microwave integrated circuits</topic><topic>Microwave measurements</topic><topic>MMIC</topic><topic>MMICs</topic><topic>Monolithic integrated circuits</topic><topic>Optical imaging</topic><topic>Power measurement</topic><topic>simulators</topic><topic>Thermal conductivity</topic><toplevel>online_resources</toplevel><creatorcontrib>Harris, T Robert</creatorcontrib><creatorcontrib>Melamed, Samson</creatorcontrib><creatorcontrib>Luniya, Sonali</creatorcontrib><creatorcontrib>Davis, W Rhett</creatorcontrib><creatorcontrib>Steer, Michael B</creatorcontrib><creatorcontrib>Doxsee, Lawrence E</creatorcontrib><creatorcontrib>Obermiller, Kurt</creatorcontrib><creatorcontrib>Hawkinson, Chad</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library Online</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Harris, T Robert</au><au>Melamed, Samson</au><au>Luniya, Sonali</au><au>Davis, W Rhett</au><au>Steer, Michael B</au><au>Doxsee, Lawrence E</au><au>Obermiller, Kurt</au><au>Hawkinson, Chad</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Thermal analysis and verification of a mounted monolithic integrated circuit</atitle><btitle>Proceedings of the IEEE SoutheastCon 2010 (SoutheastCon)</btitle><stitle>SECON</stitle><date>2010-03</date><risdate>2010</risdate><spage>37</spage><epage>40</epage><pages>37-40</pages><issn>1091-0050</issn><eissn>1558-058X</eissn><isbn>1424458544</isbn><isbn>9781424458547</isbn><eisbn>9781424458530</eisbn><eisbn>1424458536</eisbn><eisbn>1424458552</eisbn><eisbn>9781424458554</eisbn><abstract>As circuit density increases and high-power applications are facilitated, thermal considerations become paramount a design concern. In this paper, a high power monolithic microwave integrated circuit (MMIC) is modeled by the fREEDA multi-physics simulator and measured for validation. While validation is the crux of any simulation model, it is known that thermal measurements accurate to a high resolution are problematic. As such, the thermal profile of integrated circuits cannot be measured directly with infrared thermal imaging due to unequivalent emissivities of materials. It becomes necessary to use an absorptive ink to approximate a blackbody so that the infrared emissions can be used to infer temperature. The impact and effect of this thermal imaging technique is investigated in this work by comparing measurements with detailed thermal simulations with and without the surface treatment. Thermal analysis uses the finite element method and a reduced-order model based on cuboids with effective thermal conductivities. The end goal is to provide a simulation tool to designers, which can be extended to any project which requires attention to thermal preference.</abstract><pub>IEEE</pub><doi>10.1109/SECON.2010.5453924</doi><tpages>4</tpages></addata></record>
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1558-058X
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subjects Circuit simulation
compact modeling
electrothermal
fREEDA
heat transfer
Integrated circuit measurements
Integrated circuit modeling
Microwave integrated circuits
Microwave measurements
MMIC
MMICs
Monolithic integrated circuits
Optical imaging
Power measurement
simulators
Thermal conductivity
title Thermal analysis and verification of a mounted monolithic integrated circuit
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T10%3A15%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Thermal%20analysis%20and%20verification%20of%20a%20mounted%20monolithic%20integrated%20circuit&rft.btitle=Proceedings%20of%20the%20IEEE%20SoutheastCon%202010%20(SoutheastCon)&rft.au=Harris,%20T%20Robert&rft.date=2010-03&rft.spage=37&rft.epage=40&rft.pages=37-40&rft.issn=1091-0050&rft.eissn=1558-058X&rft.isbn=1424458544&rft.isbn_list=9781424458547&rft_id=info:doi/10.1109/SECON.2010.5453924&rft_dat=%3Cieee_6IE%3E5453924%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781424458530&rft.eisbn_list=1424458536&rft.eisbn_list=1424458552&rft.eisbn_list=9781424458554&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5453924&rfr_iscdi=true