High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits
A new contact RRAM cell realized by TiN/TiON layers stacked between the W-plug and n+ diffusion region inside a small 80 × 80 nm contact hole is demonstrated using 90nm CMOS logic technology. This work reports the first time a resistive switching characteristics of the TiON layers sandwiched between...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Tagungsbericht |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 4 |
---|---|
container_issue | |
container_start_page | 1 |
container_title | |
container_volume | |
creator | Yuan Heng Tseng Chia-En Huang Kuo, C.-H. Chih, Y.-D. Chrong Jung Lin |
description | A new contact RRAM cell realized by TiN/TiON layers stacked between the W-plug and n+ diffusion region inside a small 80 × 80 nm contact hole is demonstrated using 90nm CMOS logic technology. This work reports the first time a resistive switching characteristics of the TiON layers sandwiched between the metal and Si substrate. The new Contact ReRAM cell exhibits highly stable read window and very small cell size of 0.19¿m 2 . By limiting the active ReRAM film in a small contact hole region, the cell effectively operates under a very low set voltage of 4V and a reset current of 150¿A, while achieving fast set and reset speed of less than 100ns and 10us, respectively. Excellent endurance of more than 1000k cycles and stable data retention characteristics further support the new Contact ReRAM (CR-RAM) cell will be a superior NVM technology for the future. |
doi_str_mv | 10.1109/IEDM.2009.5424408 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5424408</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5424408</ieee_id><sourcerecordid>5424408</sourcerecordid><originalsourceid>FETCH-LOGICAL-i156t-8046b3c8df955300a0aa5bba3d856fe1767b698c0e0739268aea72561549c8593</originalsourceid><addsrcrecordid>eNotkE1PwkAYhNcPEgvyA4yXPeqh9d3P7h5JRSGBkKAm3sh2u4XV0ppuOeCvtwYu80wyySQzCN0RSAgB_TSfPi8TCqATwSnnoC7QkPw7ITmQSxRRImQMJP28QmOdqnPGNFyjCIhkMdFEDVCkSCw5pYrfoGEIXwA0FVpE6HvmtztcuDr47ohNXeBD1bUGh72pKmxdL8H_OtyUOGvqztgOr916ssQP2Tru-Yh9jTXUe5wtV2-4arbe4s7ZXd30_tRofWsPvgu3aFCaKrjxmSP08TJ9z2bxYvU6zyaL2PdjulgBlzmzqii1EAzAgDEizw0rlJClI6lMc6mVBQcp01Qq40xKhSSCa6uEZiN0f-r1zrnNT-v3pj1uzgeyPzBzW40</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Yuan Heng Tseng ; Chia-En Huang ; Kuo, C.-H. ; Chih, Y.-D. ; Chrong Jung Lin</creator><creatorcontrib>Yuan Heng Tseng ; Chia-En Huang ; Kuo, C.-H. ; Chih, Y.-D. ; Chrong Jung Lin</creatorcontrib><description>A new contact RRAM cell realized by TiN/TiON layers stacked between the W-plug and n+ diffusion region inside a small 80 × 80 nm contact hole is demonstrated using 90nm CMOS logic technology. This work reports the first time a resistive switching characteristics of the TiON layers sandwiched between the metal and Si substrate. The new Contact ReRAM cell exhibits highly stable read window and very small cell size of 0.19¿m 2 . By limiting the active ReRAM film in a small contact hole region, the cell effectively operates under a very low set voltage of 4V and a reset current of 150¿A, while achieving fast set and reset speed of less than 100ns and 10us, respectively. Excellent endurance of more than 1000k cycles and stable data retention characteristics further support the new Contact ReRAM (CR-RAM) cell will be a superior NVM technology for the future.</description><identifier>ISSN: 0163-1918</identifier><identifier>ISBN: 9781424456390</identifier><identifier>ISBN: 1424456398</identifier><identifier>EISSN: 2156-017X</identifier><identifier>EISBN: 1424456401</identifier><identifier>EISBN: 9781424456413</identifier><identifier>EISBN: 9781424456406</identifier><identifier>EISBN: 142445641X</identifier><identifier>DOI: 10.1109/IEDM.2009.5424408</identifier><identifier>LCCN: 81-642284</identifier><language>eng ; jpn</language><publisher>IEEE</publisher><subject>CMOS logic circuits ; CMOS process ; CMOS technology ; Logic arrays ; Microelectronics ; Nonvolatile memory ; Resistors ; Tin ; Transistors ; Voltage</subject><ispartof>2009 IEEE International Electron Devices Meeting (IEDM), 2009, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5424408$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,778,782,787,788,2054,27908,54903</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5424408$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Yuan Heng Tseng</creatorcontrib><creatorcontrib>Chia-En Huang</creatorcontrib><creatorcontrib>Kuo, C.-H.</creatorcontrib><creatorcontrib>Chih, Y.-D.</creatorcontrib><creatorcontrib>Chrong Jung Lin</creatorcontrib><title>High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits</title><title>2009 IEEE International Electron Devices Meeting (IEDM)</title><addtitle>IEDM</addtitle><description>A new contact RRAM cell realized by TiN/TiON layers stacked between the W-plug and n+ diffusion region inside a small 80 × 80 nm contact hole is demonstrated using 90nm CMOS logic technology. This work reports the first time a resistive switching characteristics of the TiON layers sandwiched between the metal and Si substrate. The new Contact ReRAM cell exhibits highly stable read window and very small cell size of 0.19¿m 2 . By limiting the active ReRAM film in a small contact hole region, the cell effectively operates under a very low set voltage of 4V and a reset current of 150¿A, while achieving fast set and reset speed of less than 100ns and 10us, respectively. Excellent endurance of more than 1000k cycles and stable data retention characteristics further support the new Contact ReRAM (CR-RAM) cell will be a superior NVM technology for the future.</description><subject>CMOS logic circuits</subject><subject>CMOS process</subject><subject>CMOS technology</subject><subject>Logic arrays</subject><subject>Microelectronics</subject><subject>Nonvolatile memory</subject><subject>Resistors</subject><subject>Tin</subject><subject>Transistors</subject><subject>Voltage</subject><issn>0163-1918</issn><issn>2156-017X</issn><isbn>9781424456390</isbn><isbn>1424456398</isbn><isbn>1424456401</isbn><isbn>9781424456413</isbn><isbn>9781424456406</isbn><isbn>142445641X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotkE1PwkAYhNcPEgvyA4yXPeqh9d3P7h5JRSGBkKAm3sh2u4XV0ppuOeCvtwYu80wyySQzCN0RSAgB_TSfPi8TCqATwSnnoC7QkPw7ITmQSxRRImQMJP28QmOdqnPGNFyjCIhkMdFEDVCkSCw5pYrfoGEIXwA0FVpE6HvmtztcuDr47ohNXeBD1bUGh72pKmxdL8H_OtyUOGvqztgOr916ssQP2Tru-Yh9jTXUe5wtV2-4arbe4s7ZXd30_tRofWsPvgu3aFCaKrjxmSP08TJ9z2bxYvU6zyaL2PdjulgBlzmzqii1EAzAgDEizw0rlJClI6lMc6mVBQcp01Qq40xKhSSCa6uEZiN0f-r1zrnNT-v3pj1uzgeyPzBzW40</recordid><startdate>200912</startdate><enddate>200912</enddate><creator>Yuan Heng Tseng</creator><creator>Chia-En Huang</creator><creator>Kuo, C.-H.</creator><creator>Chih, Y.-D.</creator><creator>Chrong Jung Lin</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200912</creationdate><title>High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits</title><author>Yuan Heng Tseng ; Chia-En Huang ; Kuo, C.-H. ; Chih, Y.-D. ; Chrong Jung Lin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i156t-8046b3c8df955300a0aa5bba3d856fe1767b698c0e0739268aea72561549c8593</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng ; jpn</language><creationdate>2009</creationdate><topic>CMOS logic circuits</topic><topic>CMOS process</topic><topic>CMOS technology</topic><topic>Logic arrays</topic><topic>Microelectronics</topic><topic>Nonvolatile memory</topic><topic>Resistors</topic><topic>Tin</topic><topic>Transistors</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Yuan Heng Tseng</creatorcontrib><creatorcontrib>Chia-En Huang</creatorcontrib><creatorcontrib>Kuo, C.-H.</creatorcontrib><creatorcontrib>Chih, Y.-D.</creatorcontrib><creatorcontrib>Chrong Jung Lin</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yuan Heng Tseng</au><au>Chia-En Huang</au><au>Kuo, C.-H.</au><au>Chih, Y.-D.</au><au>Chrong Jung Lin</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits</atitle><btitle>2009 IEEE International Electron Devices Meeting (IEDM)</btitle><stitle>IEDM</stitle><date>2009-12</date><risdate>2009</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><issn>0163-1918</issn><eissn>2156-017X</eissn><isbn>9781424456390</isbn><isbn>1424456398</isbn><eisbn>1424456401</eisbn><eisbn>9781424456413</eisbn><eisbn>9781424456406</eisbn><eisbn>142445641X</eisbn><abstract>A new contact RRAM cell realized by TiN/TiON layers stacked between the W-plug and n+ diffusion region inside a small 80 × 80 nm contact hole is demonstrated using 90nm CMOS logic technology. This work reports the first time a resistive switching characteristics of the TiON layers sandwiched between the metal and Si substrate. The new Contact ReRAM cell exhibits highly stable read window and very small cell size of 0.19¿m 2 . By limiting the active ReRAM film in a small contact hole region, the cell effectively operates under a very low set voltage of 4V and a reset current of 150¿A, while achieving fast set and reset speed of less than 100ns and 10us, respectively. Excellent endurance of more than 1000k cycles and stable data retention characteristics further support the new Contact ReRAM (CR-RAM) cell will be a superior NVM technology for the future.</abstract><pub>IEEE</pub><doi>10.1109/IEDM.2009.5424408</doi><tpages>4</tpages></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 0163-1918 |
ispartof | 2009 IEEE International Electron Devices Meeting (IEDM), 2009, p.1-4 |
issn | 0163-1918 2156-017X |
language | eng ; jpn |
recordid | cdi_ieee_primary_5424408 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | CMOS logic circuits CMOS process CMOS technology Logic arrays Microelectronics Nonvolatile memory Resistors Tin Transistors Voltage |
title | High density and ultra small cell size of Contact ReRAM (CR-RAM) in 90nm CMOS logic technology and circuits |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T04%3A27%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=High%20density%20and%20ultra%20small%20cell%20size%20of%20Contact%20ReRAM%20(CR-RAM)%20in%2090nm%20CMOS%20logic%20technology%20and%20circuits&rft.btitle=2009%20IEEE%20International%20Electron%20Devices%20Meeting%20(IEDM)&rft.au=Yuan%20Heng%20Tseng&rft.date=2009-12&rft.spage=1&rft.epage=4&rft.pages=1-4&rft.issn=0163-1918&rft.eissn=2156-017X&rft.isbn=9781424456390&rft.isbn_list=1424456398&rft_id=info:doi/10.1109/IEDM.2009.5424408&rft_dat=%3Cieee_6IE%3E5424408%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424456401&rft.eisbn_list=9781424456413&rft.eisbn_list=9781424456406&rft.eisbn_list=142445641X&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5424408&rfr_iscdi=true |