Low temperature dielectric material for embedded micro wafer level packaging

In this paper, we have developed the evaluation results of low cure temperature (less than 200 deg C) dielectric materials in terms of process ability and adhesion on SiN and mold compound substrates. The results showed that the low cure temperature dielectric materials have good adhesion on SiN and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Su, Nandar, Rao, Vempati Srinivas, Wee, Ho Soon, Sharma, Gaurav, Ying, Lim Ying, Kumar, Aditya, Damaruganath, Pinjala
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Band pass filters Capacitors Dielectric materials Dielectric substrates Dielectric thin films Silicon compounds Temperature Thin film inductors Wafer scale integration
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