Bonding head design for thin wafer
In this paper, porous vacuum picker and bonding head to impose uniform pressure on all the surface of wafer in the bonding process are proposed newly. Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which in...
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| creator | Changwoo Lee Jaehak Lee Tae Ho Ha Junyeob Song |
| description | In this paper, porous vacuum picker and bonding head to impose uniform pressure on all the surface of wafer in the bonding process are proposed newly. Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which induce small vacuum pressure at those holes region. Also, to impose uniform pressure on the wafer under bonding process, bonding head is designed using air piston type with metal ball joint, which automatically compensate for coplanarity problem of bonding pad. FEM analysis and experiments are conducted to evaluate the performance of porous vacuum picker and bonding head of air piston type. |
| doi_str_mv | 10.1109/EPTC.2009.5416546 |
| format | Conference Proceeding |
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Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which induce small vacuum pressure at those holes region. Also, to impose uniform pressure on the wafer under bonding process, bonding head is designed using air piston type with metal ball joint, which automatically compensate for coplanarity problem of bonding pad. FEM analysis and experiments are conducted to evaluate the performance of porous vacuum picker and bonding head of air piston type.</description><identifier>ISBN: 1424450993</identifier><identifier>ISBN: 9781424450992</identifier><identifier>EISBN: 1424451000</identifier><identifier>EISBN: 9781424451005</identifier><identifier>DOI: 10.1109/EPTC.2009.5416546</identifier><identifier>LCCN: 2009907331</identifier><language>eng</language><publisher>IEEE</publisher><subject>Bonding processes ; Fabrication ; Machinery ; Machining ; Magnetic heads ; Packaging ; Pistons ; Vacuum systems ; Vacuum technology ; Wafer bonding</subject><ispartof>2009 11th Electronics Packaging Technology Conference, 2009, p.220-224</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5416546$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54899</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5416546$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Changwoo Lee</creatorcontrib><creatorcontrib>Jaehak Lee</creatorcontrib><creatorcontrib>Tae Ho Ha</creatorcontrib><creatorcontrib>Junyeob Song</creatorcontrib><title>Bonding head design for thin wafer</title><title>2009 11th Electronics Packaging Technology Conference</title><addtitle>EPTC</addtitle><description>In this paper, porous vacuum picker and bonding head to impose uniform pressure on all the surface of wafer in the bonding process are proposed newly. Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which induce small vacuum pressure at those holes region. Also, to impose uniform pressure on the wafer under bonding process, bonding head is designed using air piston type with metal ball joint, which automatically compensate for coplanarity problem of bonding pad. FEM analysis and experiments are conducted to evaluate the performance of porous vacuum picker and bonding head of air piston type.</description><subject>Bonding processes</subject><subject>Fabrication</subject><subject>Machinery</subject><subject>Machining</subject><subject>Magnetic heads</subject><subject>Packaging</subject><subject>Pistons</subject><subject>Vacuum systems</subject><subject>Vacuum technology</subject><subject>Wafer bonding</subject><isbn>1424450993</isbn><isbn>9781424450992</isbn><isbn>1424451000</isbn><isbn>9781424451005</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1j81Kw0AURkekoK19AHET3CfeO3d-lxpaFQq6qOtyZzLTjmgqSUF8exXr6vDB4YMjxCVCgwj-ZvG8bhsJ4But0GhlTsQUlVRKIwCc_g_wniZi-it6sER4Jubj-PqjgNIEVp2L67t935V-W-0Sd1WXxrLtq7wfqsOu9NUn5zRciEnmtzHNj5yJl-Vi3T7Uq6f7x_Z2VRe0-lATG5IqEjsghSnajqNzFDBzYilJ6uCDkUZrCxzQaRs4gsPowBqZLc3E1d9vSSltPobyzsPX5hhI3xMzP4Y</recordid><startdate>200912</startdate><enddate>200912</enddate><creator>Changwoo Lee</creator><creator>Jaehak Lee</creator><creator>Tae Ho Ha</creator><creator>Junyeob Song</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200912</creationdate><title>Bonding head design for thin wafer</title><author>Changwoo Lee ; Jaehak Lee ; Tae Ho Ha ; Junyeob Song</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-3a6324c3a80341ec7dac883b1faea22325b9b6265570ab1857bac081c80762f73</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Bonding processes</topic><topic>Fabrication</topic><topic>Machinery</topic><topic>Machining</topic><topic>Magnetic heads</topic><topic>Packaging</topic><topic>Pistons</topic><topic>Vacuum systems</topic><topic>Vacuum technology</topic><topic>Wafer bonding</topic><toplevel>online_resources</toplevel><creatorcontrib>Changwoo Lee</creatorcontrib><creatorcontrib>Jaehak Lee</creatorcontrib><creatorcontrib>Tae Ho Ha</creatorcontrib><creatorcontrib>Junyeob Song</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Changwoo Lee</au><au>Jaehak Lee</au><au>Tae Ho Ha</au><au>Junyeob Song</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Bonding head design for thin wafer</atitle><btitle>2009 11th Electronics Packaging Technology Conference</btitle><stitle>EPTC</stitle><date>2009-12</date><risdate>2009</risdate><spage>220</spage><epage>224</epage><pages>220-224</pages><isbn>1424450993</isbn><isbn>9781424450992</isbn><eisbn>1424451000</eisbn><eisbn>9781424451005</eisbn><abstract>In this paper, porous vacuum picker and bonding head to impose uniform pressure on all the surface of wafer in the bonding process are proposed newly. Porous vacuum picker could reduce deformation and warpage problem during handling thin wafer because it has many number of small vacuum hole which induce small vacuum pressure at those holes region. Also, to impose uniform pressure on the wafer under bonding process, bonding head is designed using air piston type with metal ball joint, which automatically compensate for coplanarity problem of bonding pad. FEM analysis and experiments are conducted to evaluate the performance of porous vacuum picker and bonding head of air piston type.</abstract><pub>IEEE</pub><doi>10.1109/EPTC.2009.5416546</doi><tpages>5</tpages></addata></record> |
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| ispartof | 2009 11th Electronics Packaging Technology Conference, 2009, p.220-224 |
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| language | eng |
| recordid | cdi_ieee_primary_5416546 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Bonding processes Fabrication Machinery Machining Magnetic heads Packaging Pistons Vacuum systems Vacuum technology Wafer bonding |
| title | Bonding head design for thin wafer |
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