Development of high speed board level bend tester for drop impact applications

Due to the widespread use of portable electronics, there is a significant increase in interest in exploring the impact reliability of electronic packaging during impact shock. Currently, the test standard used for board level drop testing is JESD 22-B111, which specifies the impact pulse (i.e. 1500...

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Bibliographische Detailangaben

Hauptverfasser:	Shu Min Lim, Zhong Chen, Hun Shen Ng, Tong Yan Tee, Choong Peng Khoo, Chng, V., Fu Lin Liu, Kuo Tsing Tsai
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Circuit testing Fixtures Frequency Life testing Materials science and technology Materials testing Packaging Performance evaluation Stress
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