Development of negative profile of dry film resist for metal lift off process

A dry film photoresist was selected as the sacrificial material for a metal lift off process. However, a weak and inconsistent adhesion of the evaporated under bump metallurgy (UBM) and solder on the passivation surface was observed during the dry film stripping process. This problem may be due to t...

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Bibliographische Detailangaben

Hauptverfasser:	Chew, Michelle, Ho, Soon Wee, Su, Nandar, Liao, Ebin, Rao, Vempati Srinivas, Premachandran, C.S., Kumar, Rakesh, Damaruganath, Pinjala
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Costs Inorganic materials Materials science and technology Microelectronics Passivation Resists Standards development Substrates Testing
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