Correlation between the thermophysical properties, geometry and microstructure of the SAC305 and SAC-X typical solder joints

The quality and reliability of microelectronics components and assemblies can be considered as expression of solder joints functionality. The functionality of the lead free-solder joints is in strong connection with the microstructure, which is the result of the temperature gradient action over the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Branzei, M., Svasta, P., Miculescu, F., Miculescu, M., Plotog, I.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Electronic components Environmentally friendly manufacturing techniques Geometry Lead Microelectronics Microstructure Soldering Temperature Volume measurement
Online-Zugang:	Volltext bestellen
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