Signal integrity analysis of high speed USB IO and interconnection

This paper analyzed the signal integrity of high speed USB IO and IC package. Time domain modeling and measurement were studied and compared. The effect of the die junction temperature and the effect of process variations (typical and worst process parameters) were studied. Through the time domain s...

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Hauptverfasser: Tinghou Chen, Pinghua Luo, Huili Fu
Format: Tagungsbericht
Sprache:eng
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Beschreibung
Zusammenfassung:This paper analyzed the signal integrity of high speed USB IO and IC package. Time domain modeling and measurement were studied and compared. The effect of the die junction temperature and the effect of process variations (typical and worst process parameters) were studied. Through the time domain signal integrity analysis, high signal quality and low cost design of high speed USB IO, package and PCB can be implemented.
ISSN:2151-1225
2151-1233
DOI:10.1109/EDAPS.2009.5403980