Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

From the available mass production devices of HFCBGAs, there can be a range of surface roughness with different surface finished of silicon dies and heat spreader. An aluminum filled gel is used to examine the surfaces clamping with both identical substrates at both sides whether compatible to the t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tong Hong Wang, Paisner, S.N., Chang-Chi Lee, Chen, S., Yi-Shao Lai
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum Clamps Copper Electrical resistance measurement Mass production Rough surfaces Silicon Surface finishing Surface roughness Thermal resistance
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