A New Haptic Model Using Bond Graphs
Main difficulty in the haptic rendering is to compute and generate stable feedback force from not only rigid objects but also deformable object with a same haptic model. This paper presents a new model which can simulate the haptic behavior of rigid/deformable objects without changing haptic represe...
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| creator | Sang-Youn Kim Yong-Ho Yoo |
| description | Main difficulty in the haptic rendering is to compute and generate stable feedback force from not only rigid objects but also deformable object with a same haptic model. This paper presents a new model which can simulate the haptic behavior of rigid/deformable objects without changing haptic representation. We call this representation unified haptic model. For constructing unified haptic model, we use a bond graph representation which is a unified modeling method of a wide range of materials in the energy domain. Using bond graphs, we first define a 1D particle model for elastic and plastic deformation. After that it is extended to 2D and 3D deformable models. Finally, the proposed model is simulated and animated. |
| doi_str_mv | 10.1109/ICCIT.2009.312 |
| format | Conference Proceeding |
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Finally, the proposed model is simulated and animated.</description><subject>bond graph</subject><subject>Bonding</subject><subject>Computational modeling</subject><subject>Deformable models</subject><subject>energy-based modeling</subject><subject>Finite element methods</subject><subject>Fluid dynamics</subject><subject>Force feedback</subject><subject>Haptic interfaces</subject><subject>haptics</subject><subject>Material properties</subject><subject>Plastics</subject><subject>Springs</subject><subject>unified modeling</subject><isbn>9781424452446</isbn><isbn>1424452449</isbn><isbn>9780769538969</isbn><isbn>0769538967</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjLFOwzAUAI0QEqhkZWHxwJrwHDvPfmOJoI1U2qWdKzt5BkuljeJKiL8HAcPpdMsJcaegUgrosWvbblvVAFRpVV-IgqwDi9RoR0iXv61MbUzzA16LIucUoEaLCA5uxMNcrvlTLv14Tr18PQ18kLucjm_y6XQc5GLy43u-FVfRHzIX_56J3cvztl2Wq82ia-erMinbnEuMDNFasp5VdGScH0K0CrUPEYMJxjF67CNy73qnFfBgdEQi5zXEoPVM3P99EzPvxyl9-Olr32i0BEZ_A2NhP9U</recordid><startdate>200911</startdate><enddate>200911</enddate><creator>Sang-Youn Kim</creator><creator>Yong-Ho Yoo</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200911</creationdate><title>A New Haptic Model Using Bond Graphs</title><author>Sang-Youn Kim ; Yong-Ho Yoo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6fe0f7797ae1f8948adbf7163abf6b4b48e6a6cf6ec8c8310ed43f6998a30fb33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>bond graph</topic><topic>Bonding</topic><topic>Computational modeling</topic><topic>Deformable models</topic><topic>energy-based modeling</topic><topic>Finite element methods</topic><topic>Fluid dynamics</topic><topic>Force feedback</topic><topic>Haptic interfaces</topic><topic>haptics</topic><topic>Material properties</topic><topic>Plastics</topic><topic>Springs</topic><topic>unified modeling</topic><toplevel>online_resources</toplevel><creatorcontrib>Sang-Youn Kim</creatorcontrib><creatorcontrib>Yong-Ho Yoo</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sang-Youn Kim</au><au>Yong-Ho Yoo</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>A New Haptic Model Using Bond Graphs</atitle><btitle>2009 Fourth International Conference on Computer Sciences and Convergence Information Technology</btitle><stitle>ICCIT</stitle><date>2009-11</date><risdate>2009</risdate><spage>387</spage><epage>392</epage><pages>387-392</pages><isbn>9781424452446</isbn><isbn>1424452449</isbn><eisbn>9780769538969</eisbn><eisbn>0769538967</eisbn><abstract>Main difficulty in the haptic rendering is to compute and generate stable feedback force from not only rigid objects but also deformable object with a same haptic model. This paper presents a new model which can simulate the haptic behavior of rigid/deformable objects without changing haptic representation. We call this representation unified haptic model. For constructing unified haptic model, we use a bond graph representation which is a unified modeling method of a wide range of materials in the energy domain. Using bond graphs, we first define a 1D particle model for elastic and plastic deformation. After that it is extended to 2D and 3D deformable models. Finally, the proposed model is simulated and animated.</abstract><pub>IEEE</pub><doi>10.1109/ICCIT.2009.312</doi><tpages>6</tpages></addata></record> |
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| subjects | bond graph Bonding Computational modeling Deformable models energy-based modeling Finite element methods Fluid dynamics Force feedback Haptic interfaces haptics Material properties Plastics Springs unified modeling |
| title | A New Haptic Model Using Bond Graphs |
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