Parasitic effects on nanoassembly processes
This paper analyzes the disturbance sources acting on nano-assembly systems inside the scanning electron microscope, which complicate the automation of assembly processes in the scanning electron microscope. The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vib...
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creator | Wich, T. Stolle, C. Edeler, C. Fatikow, S. |
description | This paper analyzes the disturbance sources acting on nano-assembly systems inside the scanning electron microscope, which complicate the automation of assembly processes in the scanning electron microscope. The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vibrations due to actuator movements are examined and approaches are suggested. The electron-beam interaction with the assembly system has been identified as another disturbance source and its impact on automated assembly processes is qualified and quantified. Solutions for disturbance-resistant assembly processes are suggested. |
doi_str_mv | 10.1109/IROS.2009.5354016 |
format | Conference Proceeding |
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The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vibrations due to actuator movements are examined and approaches are suggested. The electron-beam interaction with the assembly system has been identified as another disturbance source and its impact on automated assembly processes is qualified and quantified. 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The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vibrations due to actuator movements are examined and approaches are suggested. The electron-beam interaction with the assembly system has been identified as another disturbance source and its impact on automated assembly processes is qualified and quantified. Solutions for disturbance-resistant assembly processes are suggested.</description><subject>Actuators</subject><subject>Assembly systems</subject><subject>End effectors</subject><subject>Instruments</subject><subject>Intelligent robots</subject><subject>Mechanical sensors</subject><subject>Scanning electron microscopy</subject><subject>Tactile sensors</subject><subject>USA Councils</subject><subject>Vibrations</subject><issn>2153-0858</issn><issn>2153-0866</issn><isbn>9781424438037</isbn><isbn>1424438039</isbn><isbn>9781424438044</isbn><isbn>1424438047</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpVkEtLw0AUhcdHwVrzA8RN9pJ477xnKaVqoVDxsS4z0zsQaZOSyab_3ohF8GwOh-9wFoexW4QaEdzD8m39XnMAVyuhJKA-Y4UzFiWXUliQ8pxNOSpRgdX64h8T5vKPKTth1z8zDoBbuGJFzl8wSipuuZ6y-1ff-9wMTSwpJYpDLru2bH3b-ZxpH3bH8tB3kcaQb9gk-V2m4uQz9vm0-Ji_VKv183L-uKoaNGqokg2KRBCGlPPSUZJbsh6D4zqAMwZorGlj0IBDdAheBLlNyIWOXvgoZuzud7chos2hb_a-P25OP4hvEjJI_w</recordid><startdate>200910</startdate><enddate>200910</enddate><creator>Wich, T.</creator><creator>Stolle, C.</creator><creator>Edeler, C.</creator><creator>Fatikow, S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200910</creationdate><title>Parasitic effects on nanoassembly processes</title><author>Wich, T. ; Stolle, C. ; Edeler, C. ; Fatikow, S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-f8b5e3b37e59a49ef4de8a1b926b09770e175677170911910a3b4df1236ca3ac3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Actuators</topic><topic>Assembly systems</topic><topic>End effectors</topic><topic>Instruments</topic><topic>Intelligent robots</topic><topic>Mechanical sensors</topic><topic>Scanning electron microscopy</topic><topic>Tactile sensors</topic><topic>USA Councils</topic><topic>Vibrations</topic><toplevel>online_resources</toplevel><creatorcontrib>Wich, T.</creatorcontrib><creatorcontrib>Stolle, C.</creatorcontrib><creatorcontrib>Edeler, C.</creatorcontrib><creatorcontrib>Fatikow, S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wich, T.</au><au>Stolle, C.</au><au>Edeler, C.</au><au>Fatikow, S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Parasitic effects on nanoassembly processes</atitle><btitle>2009 IEEE/RSJ International Conference on Intelligent Robots and Systems</btitle><stitle>IROS</stitle><date>2009-10</date><risdate>2009</risdate><spage>1389</spage><epage>1394</epage><pages>1389-1394</pages><issn>2153-0858</issn><eissn>2153-0866</eissn><isbn>9781424438037</isbn><isbn>1424438039</isbn><eisbn>9781424438044</eisbn><eisbn>1424438047</eisbn><abstract>This paper analyzes the disturbance sources acting on nano-assembly systems inside the scanning electron microscope, which complicate the automation of assembly processes in the scanning electron microscope. The influence of intrinsic sources, i.e. thermal drift, actuator offset and end effector vibrations due to actuator movements are examined and approaches are suggested. The electron-beam interaction with the assembly system has been identified as another disturbance source and its impact on automated assembly processes is qualified and quantified. Solutions for disturbance-resistant assembly processes are suggested.</abstract><pub>IEEE</pub><doi>10.1109/IROS.2009.5354016</doi><tpages>6</tpages></addata></record> |
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subjects | Actuators Assembly systems End effectors Instruments Intelligent robots Mechanical sensors Scanning electron microscopy Tactile sensors USA Councils Vibrations |
title | Parasitic effects on nanoassembly processes |
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