Photonic integration in a commercial scaled bulk-CMOS process
We demonstrate the first photonic chip designed for a commercial bulk CMOS process (65 nm-node) using standard process layers combined with post-processing, enabling dense photonic integration with high-performance microprocessor electronics.
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | We demonstrate the first photonic chip designed for a commercial bulk CMOS process (65 nm-node) using standard process layers combined with post-processing, enabling dense photonic integration with high-performance microprocessor electronics. |
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ISSN: | 2155-8507 |
DOI: | 10.1109/PS.2009.5307769 |