Warpage prediction of fine pitch BGA by finite element analysis and shadow moiré technique

Warpage is one of the major concerns in manufacturing BGA, CSP, POP or QFN based array packages because a reasonably flat package is critical to successful singulation and board level assembly processes. Warpage of a package is a result of curing shrinkage of encapsulated mold compounds (EMC) and CT...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ke Xue, Jingshen Wu, Haibin Chen, Jingbo Gai, Lam, A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Chemicals Chip scale packaging Curing Electromagnetic compatibility Finite element methods Manufacturing processes Material properties Polymers Semiconductor device modeling
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