Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder
In this paper, Traces of Cr were added into Sn-8Zn-3Bi solder alloys to study the influences of Cr on mechanical properties and high temperature reliability of solder alloys by room temperature tensile test and high-temperature aging treatment. With observation of microstructure and fracture surface...
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| creator | Tingbi Luo Anmin Hu Ming Li Dali Mao |
| description | In this paper, Traces of Cr were added into Sn-8Zn-3Bi solder alloys to study the influences of Cr on mechanical properties and high temperature reliability of solder alloys by room temperature tensile test and high-temperature aging treatment. With observation of microstructure and fracture surface analysis, the strengthening mechanisms of Cr in solder alloys were discussed. Experiments show that: the microstructure was refined after traces of Cr added and two kinds of intermetallic compound (IMC) formed. Therefore the addition of Cr improved the plasticity of Sn-8Zn-3Bi alloy. The elongation reached up to 50.96% after 0.1% Cr added; and the fracture mechanism converted from quasi-cleavage fracture into ductile fracture. But after more than 0.3% Cr added, the brittleness of the alloy increased. During 0, 4, 9, 16 days aging, the mechanical properties of Sn-8Zn-3Bi-0.3Cr alloy were improving slightly with aging time. Through the microstructure analysis it was found that the Sn-Zn-Cr phase was transited after aging and Zn in alloy was consumed, so that primary Zn phase was reduced and microstructure was improved. |
| doi_str_mv | 10.1109/ICEPT.2009.5270636 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5270636</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5270636</ieee_id><sourcerecordid>5270636</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-ac70ae5c64099f90aa2dfb5b6269b86bb3ceb59bd1abca9a646e2d7e337ea1e23</originalsourceid><addsrcrecordid>eNo1UM1KxDAYjMiC7toX0EteIDVN06Q5all1YUFh9-Rl-ZJ8xUj_SNuDb2_VdS7DwMwwDCG3GU-zjJv7XbV9O6aCc5MWQnOVqwuyzqSQUqrC6EuSGF3-61KsyPrHa7hUJb8iyTh-8gVyyZb6mhwO0-wDjrTvaBtc7Mcpzm6aI1LoPG3RfUAXHDR0iP2Acfr11vTQsfeOPQZWRdogeFZHRDr2jcd4Q1Y1NCMmZ96Q49P2WL2w_evzrnrYs2D4xMBpDlg4JZd1teEAwte2sEooY0tlbe7QFsb6DKwDA0oqFF5jnmuEDEW-IXd_tQERT0MMLcSv0_mT_BtHNVR9</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Tingbi Luo ; Anmin Hu ; Ming Li ; Dali Mao</creator><creatorcontrib>Tingbi Luo ; Anmin Hu ; Ming Li ; Dali Mao</creatorcontrib><description>In this paper, Traces of Cr were added into Sn-8Zn-3Bi solder alloys to study the influences of Cr on mechanical properties and high temperature reliability of solder alloys by room temperature tensile test and high-temperature aging treatment. With observation of microstructure and fracture surface analysis, the strengthening mechanisms of Cr in solder alloys were discussed. Experiments show that: the microstructure was refined after traces of Cr added and two kinds of intermetallic compound (IMC) formed. Therefore the addition of Cr improved the plasticity of Sn-8Zn-3Bi alloy. The elongation reached up to 50.96% after 0.1% Cr added; and the fracture mechanism converted from quasi-cleavage fracture into ductile fracture. But after more than 0.3% Cr added, the brittleness of the alloy increased. During 0, 4, 9, 16 days aging, the mechanical properties of Sn-8Zn-3Bi-0.3Cr alloy were improving slightly with aging time. Through the microstructure analysis it was found that the Sn-Zn-Cr phase was transited after aging and Zn in alloy was consumed, so that primary Zn phase was reduced and microstructure was improved.</description><identifier>ISBN: 9781424446582</identifier><identifier>ISBN: 1424446589</identifier><identifier>EISBN: 1424446597</identifier><identifier>EISBN: 9781424446599</identifier><identifier>DOI: 10.1109/ICEPT.2009.5270636</identifier><identifier>LCCN: 2009904680</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aging ; Chromium alloys ; Environmentally friendly manufacturing techniques ; Lead ; Mechanical factors ; Microstructure ; Surface cracks ; Temperature ; Testing ; Zinc</subject><ispartof>2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009, p.815-818</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5270636$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5270636$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Tingbi Luo</creatorcontrib><creatorcontrib>Anmin Hu</creatorcontrib><creatorcontrib>Ming Li</creatorcontrib><creatorcontrib>Dali Mao</creatorcontrib><title>Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder</title><title>2009 International Conference on Electronic Packaging Technology & High Density Packaging</title><addtitle>ICEPT</addtitle><description>In this paper, Traces of Cr were added into Sn-8Zn-3Bi solder alloys to study the influences of Cr on mechanical properties and high temperature reliability of solder alloys by room temperature tensile test and high-temperature aging treatment. With observation of microstructure and fracture surface analysis, the strengthening mechanisms of Cr in solder alloys were discussed. Experiments show that: the microstructure was refined after traces of Cr added and two kinds of intermetallic compound (IMC) formed. Therefore the addition of Cr improved the plasticity of Sn-8Zn-3Bi alloy. The elongation reached up to 50.96% after 0.1% Cr added; and the fracture mechanism converted from quasi-cleavage fracture into ductile fracture. But after more than 0.3% Cr added, the brittleness of the alloy increased. During 0, 4, 9, 16 days aging, the mechanical properties of Sn-8Zn-3Bi-0.3Cr alloy were improving slightly with aging time. Through the microstructure analysis it was found that the Sn-Zn-Cr phase was transited after aging and Zn in alloy was consumed, so that primary Zn phase was reduced and microstructure was improved.</description><subject>Aging</subject><subject>Chromium alloys</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Lead</subject><subject>Mechanical factors</subject><subject>Microstructure</subject><subject>Surface cracks</subject><subject>Temperature</subject><subject>Testing</subject><subject>Zinc</subject><isbn>9781424446582</isbn><isbn>1424446589</isbn><isbn>1424446597</isbn><isbn>9781424446599</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UM1KxDAYjMiC7toX0EteIDVN06Q5all1YUFh9-Rl-ZJ8xUj_SNuDb2_VdS7DwMwwDCG3GU-zjJv7XbV9O6aCc5MWQnOVqwuyzqSQUqrC6EuSGF3-61KsyPrHa7hUJb8iyTh-8gVyyZb6mhwO0-wDjrTvaBtc7Mcpzm6aI1LoPG3RfUAXHDR0iP2Acfr11vTQsfeOPQZWRdogeFZHRDr2jcd4Q1Y1NCMmZ96Q49P2WL2w_evzrnrYs2D4xMBpDlg4JZd1teEAwte2sEooY0tlbe7QFsb6DKwDA0oqFF5jnmuEDEW-IXd_tQERT0MMLcSv0_mT_BtHNVR9</recordid><startdate>200908</startdate><enddate>200908</enddate><creator>Tingbi Luo</creator><creator>Anmin Hu</creator><creator>Ming Li</creator><creator>Dali Mao</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200908</creationdate><title>Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder</title><author>Tingbi Luo ; Anmin Hu ; Ming Li ; Dali Mao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-ac70ae5c64099f90aa2dfb5b6269b86bb3ceb59bd1abca9a646e2d7e337ea1e23</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Aging</topic><topic>Chromium alloys</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Lead</topic><topic>Mechanical factors</topic><topic>Microstructure</topic><topic>Surface cracks</topic><topic>Temperature</topic><topic>Testing</topic><topic>Zinc</topic><toplevel>online_resources</toplevel><creatorcontrib>Tingbi Luo</creatorcontrib><creatorcontrib>Anmin Hu</creatorcontrib><creatorcontrib>Ming Li</creatorcontrib><creatorcontrib>Dali Mao</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tingbi Luo</au><au>Anmin Hu</au><au>Ming Li</au><au>Dali Mao</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder</atitle><btitle>2009 International Conference on Electronic Packaging Technology & High Density Packaging</btitle><stitle>ICEPT</stitle><date>2009-08</date><risdate>2009</risdate><spage>815</spage><epage>818</epage><pages>815-818</pages><isbn>9781424446582</isbn><isbn>1424446589</isbn><eisbn>1424446597</eisbn><eisbn>9781424446599</eisbn><abstract>In this paper, Traces of Cr were added into Sn-8Zn-3Bi solder alloys to study the influences of Cr on mechanical properties and high temperature reliability of solder alloys by room temperature tensile test and high-temperature aging treatment. With observation of microstructure and fracture surface analysis, the strengthening mechanisms of Cr in solder alloys were discussed. Experiments show that: the microstructure was refined after traces of Cr added and two kinds of intermetallic compound (IMC) formed. Therefore the addition of Cr improved the plasticity of Sn-8Zn-3Bi alloy. The elongation reached up to 50.96% after 0.1% Cr added; and the fracture mechanism converted from quasi-cleavage fracture into ductile fracture. But after more than 0.3% Cr added, the brittleness of the alloy increased. During 0, 4, 9, 16 days aging, the mechanical properties of Sn-8Zn-3Bi-0.3Cr alloy were improving slightly with aging time. Through the microstructure analysis it was found that the Sn-Zn-Cr phase was transited after aging and Zn in alloy was consumed, so that primary Zn phase was reduced and microstructure was improved.</abstract><pub>IEEE</pub><doi>10.1109/ICEPT.2009.5270636</doi><tpages>4</tpages></addata></record> |
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| subjects | Aging Chromium alloys Environmentally friendly manufacturing techniques Lead Mechanical factors Microstructure Surface cracks Temperature Testing Zinc |
| title | Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T06%3A07%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Studies%20on%20microstructure%20and%20mechanical%20properties%20of%20Sn-Zn-Bi-Cr%20lead-free%20solder&rft.btitle=2009%20International%20Conference%20on%20Electronic%20Packaging%20Technology%20&%20High%20Density%20Packaging&rft.au=Tingbi%20Luo&rft.date=2009-08&rft.spage=815&rft.epage=818&rft.pages=815-818&rft.isbn=9781424446582&rft.isbn_list=1424446589&rft_id=info:doi/10.1109/ICEPT.2009.5270636&rft_dat=%3Cieee_6IE%3E5270636%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1424446597&rft.eisbn_list=9781424446599&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5270636&rfr_iscdi=true |