Studies on microstructure of epoxy molding compound (EMC)-Leadframe interface after environmental aging

The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental agi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Xiuzhen Lu, Li Xu, Huaxiang Lai, Xinyu Du, Liu, J., Zhaonian Cheng
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adhesives Aging Coatings Copper Delamination Electromagnetic compatibility Gold Lead compounds Microstructure Scanning electron microscopy
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!