Reliability of novel die attach adhesive for snap curing

Novel adhesive, using in-line process, has been shown to reduce adhesive cure cycle time from 70 minutes to as little as 44 seconds at 160/spl deg/C. Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is base...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Galloway, D.P., Grosse, M., Nguyen, M.N., Burkhart, A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Curing Microassembly Moisture Ovens Polymers Production equipment Resins Stability Temperature Throughput
Online-Zugang:	Volltext bestellen
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