Reliability of novel die attach adhesive for snap curing
Novel adhesive, using in-line process, has been shown to reduce adhesive cure cycle time from 70 minutes to as little as 44 seconds at 160/spl deg/C. Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is base...
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| creator | Galloway, D.P. Grosse, M. Nguyen, M.N. Burkhart, A. |
| description | Novel adhesive, using in-line process, has been shown to reduce adhesive cure cycle time from 70 minutes to as little as 44 seconds at 160/spl deg/C. Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is based upon a modified cyanate ester resin, which cures to form a triazine polymer with excellent temperature stability and unique moisture properties. It generates 75% less outgassing during cure than typical snap sure epoxies, which reduces contamination of the chip, leadframe and oven chamber. Live device reliability, equivalent to standard box oven, has been demonstrated for the new snap cure adhesive using in-line cure, as well as, fast box oven process. Material, processing and qualification data is summarized and compared to epoxies for analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles. The material has been fully qualified and is in production use. |
| doi_str_mv | 10.1109/IEMT.1995.526106 |
| format | Conference Proceeding |
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Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is based upon a modified cyanate ester resin, which cures to form a triazine polymer with excellent temperature stability and unique moisture properties. It generates 75% less outgassing during cure than typical snap sure epoxies, which reduces contamination of the chip, leadframe and oven chamber. Live device reliability, equivalent to standard box oven, has been demonstrated for the new snap cure adhesive using in-line cure, as well as, fast box oven process. Material, processing and qualification data is summarized and compared to epoxies for analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles. The material has been fully qualified and is in production use.</description><identifier>ISBN: 0780329961</identifier><identifier>ISBN: 9780780329966</identifier><identifier>DOI: 10.1109/IEMT.1995.526106</identifier><language>eng</language><publisher>IEEE</publisher><subject>Curing ; Microassembly ; Moisture ; Ovens ; Polymers ; Production equipment ; Resins ; Stability ; Temperature ; Throughput</subject><ispartof>Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 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Material, processing and qualification data is summarized and compared to epoxies for analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles. The material has been fully qualified and is in production use.</description><subject>Curing</subject><subject>Microassembly</subject><subject>Moisture</subject><subject>Ovens</subject><subject>Polymers</subject><subject>Production equipment</subject><subject>Resins</subject><subject>Stability</subject><subject>Temperature</subject><subject>Throughput</subject><isbn>0780329961</isbn><isbn>9780780329966</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1995</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9jj0PgjAUAJsYE7_YjdP7A2ILFuhsMDq4GHZS4SHPVCAtkvDvNdHZW2645RhbC-4LwdXunF4yXyglfRlEgkcTtuBxwsNAqUjMmOfcg3_YSxmqeM6SKxrSNzLUj9BW0LQDGigJQfe9LmrQZY2OBoSqteAa3UHxstTcV2xaaePQ-3nJNsc0O5y2hIh5Z-mp7Zh_H8K_8Q0wxDUR</recordid><startdate>1995</startdate><enddate>1995</enddate><creator>Galloway, D.P.</creator><creator>Grosse, M.</creator><creator>Nguyen, M.N.</creator><creator>Burkhart, A.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1995</creationdate><title>Reliability of novel die attach adhesive for snap curing</title><author>Galloway, D.P. ; Grosse, M. ; Nguyen, M.N. ; Burkhart, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_5261063</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Curing</topic><topic>Microassembly</topic><topic>Moisture</topic><topic>Ovens</topic><topic>Polymers</topic><topic>Production equipment</topic><topic>Resins</topic><topic>Stability</topic><topic>Temperature</topic><topic>Throughput</topic><toplevel>online_resources</toplevel><creatorcontrib>Galloway, D.P.</creatorcontrib><creatorcontrib>Grosse, M.</creatorcontrib><creatorcontrib>Nguyen, M.N.</creatorcontrib><creatorcontrib>Burkhart, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Galloway, D.P.</au><au>Grosse, M.</au><au>Nguyen, M.N.</au><au>Burkhart, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Reliability of novel die attach adhesive for snap curing</atitle><btitle>Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'</btitle><stitle>IEMT</stitle><date>1995</date><risdate>1995</risdate><spage>141</spage><epage>147</epage><pages>141-147</pages><isbn>0780329961</isbn><isbn>9780780329966</isbn><abstract>Novel adhesive, using in-line process, has been shown to reduce adhesive cure cycle time from 70 minutes to as little as 44 seconds at 160/spl deg/C. Throughput improvement of 60% using existing box ovens and no increase in floor space has been confirmed on production equipment. The adhesive is based upon a modified cyanate ester resin, which cures to form a triazine polymer with excellent temperature stability and unique moisture properties. It generates 75% less outgassing during cure than typical snap sure epoxies, which reduces contamination of the chip, leadframe and oven chamber. Live device reliability, equivalent to standard box oven, has been demonstrated for the new snap cure adhesive using in-line cure, as well as, fast box oven process. Material, processing and qualification data is summarized and compared to epoxies for analog and logic ICs packaged in SOIC, PDIP, and PLCC body styles. The material has been fully qualified and is in production use.</abstract><pub>IEEE</pub><doi>10.1109/IEMT.1995.526106</doi></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 0780329961 |
| ispartof | Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future', 1995, p.141-147 |
| issn | |
| language | eng |
| recordid | cdi_ieee_primary_526106 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Curing Microassembly Moisture Ovens Polymers Production equipment Resins Stability Temperature Throughput |
| title | Reliability of novel die attach adhesive for snap curing |
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