3D Stacked Package Technology and Its Application Prospects

In recent years, the increasing demands for the high performance integrated circuit devices have led to the development of multi-die stacked technology in a single package form. The 3D (three dimension) stacked package technology is developing trend of the integrated circuit advanced high-density pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jianyong Zheng, Zhisheng Zhang, Yigao Chen, Jinfei Shi
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	3D stacked package Advantage Cellular phones Chip scale packaging Costs Development trends Dielectric substrates Digital cameras Electronics packaging Integrated circuit Integrated circuit packaging Integrated circuit technology Personal digital assistants Stacking
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