Highly Accurate Management in Dynamically Changing Fab
Semiconductor fab capability improvement is usually discussed in the context of static conditions. This paper focuses on a rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environm...
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| Veröffentlicht in: | IEEE transactions on semiconductor manufacturing 2009-11, Vol.22 (4), p.482-490 |
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| container_title | IEEE transactions on semiconductor manufacturing |
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| creator | Imaoka, K. Ishii, Y. Kikuchi, T. Sugawa, S. Nagahira, A. |
| description | Semiconductor fab capability improvement is usually discussed in the context of static conditions. This paper focuses on a rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments, where the Turn is maintained uniformly in each segment while the increased Move capability is sequentially allocated and shifted from one segment to the next, from input side to output side of the manufacturing process. The effectiveness of this method has been demonstrated in a NOR flash memory fab. |
| doi_str_mv | 10.1109/TSM.2009.2031773 |
| format | Article |
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This paper focuses on a rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments, where the Turn is maintained uniformly in each segment while the increased Move capability is sequentially allocated and shifted from one segment to the next, from input side to output side of the manufacturing process. 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Microelectronics. Optoelectronics. Solid state devices ; semiconductor manufacturing ; Semiconductors ; Throughput ; work in process (WIP) control</subject><ispartof>IEEE transactions on semiconductor manufacturing, 2009-11, Vol.22 (4), p.482-490</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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This paper focuses on a rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments, where the Turn is maintained uniformly in each segment while the increased Move capability is sequentially allocated and shifted from one segment to the next, from input side to output side of the manufacturing process. The effectiveness of this method has been demonstrated in a NOR flash memory fab.</description><subject>Applied sciences</subject><subject>Circuit properties</subject><subject>Cycle time</subject><subject>Digital circuits</subject><subject>Dispatching</subject><subject>Dynamics</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Flash memory</subject><subject>Flash memory (computers)</subject><subject>General (including economical and industrial fields)</subject><subject>Integrated circuits</subject><subject>Integrated circuits by function (including memories and processors)</subject><subject>Job shop scheduling</subject><subject>Management</subject><subject>Manufacturing processes</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>operation management</subject><subject>Process control</subject><subject>Production control</subject><subject>Productivity</subject><subject>Real time systems</subject><subject>Segments</subject><subject>Semiconductor device manufacture</subject><subject>Semiconductor electronics. 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Solid state devices</subject><subject>semiconductor manufacturing</subject><subject>Semiconductors</subject><subject>Throughput</subject><subject>work in process (WIP) control</subject><issn>0894-6507</issn><issn>1558-2345</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkEFPAjEQRhujiYjeTbxsTIynxWm7pe2RoKgJxIN4bmZLF5YsBdvdA__eEggHLzOHefNl5hFyT2FAKeiX-fdswAB0KpxKyS9IjwqhcsYLcUl6oHSRDwXIa3IT4xqAFoWWPTL8qJerZp-NrO0Cti6bocel2zjfZrXPXvceN7XFJiHjFfpl7ZfZBMtbclVhE93dqffJz-RtPv7Ip1_vn-PRNLccRJujVNwJKJUYauuYkhat1EgLxZwoXDVkVCKUJWjNJC6glFxythCFZhV1yvI-eT7m7sL2t3OxNZs6Wtc06N22i0ZJARyoKBL5-I9cb7vg03FGUwZMMckTBEfIhm2MwVVmF-oNhr2hYA4aTdJoDhrNSWNaeTrlYkweqoDe1vG8x9ghWajEPRy52jl3HgvG0--M_wEpz3ho</recordid><startdate>20091101</startdate><enddate>20091101</enddate><creator>Imaoka, K.</creator><creator>Ishii, Y.</creator><creator>Kikuchi, T.</creator><creator>Sugawa, S.</creator><creator>Nagahira, A.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Solid state devices</topic><topic>semiconductor manufacturing</topic><topic>Semiconductors</topic><topic>Throughput</topic><topic>work in process (WIP) control</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Imaoka, K.</creatorcontrib><creatorcontrib>Ishii, Y.</creatorcontrib><creatorcontrib>Kikuchi, T.</creatorcontrib><creatorcontrib>Sugawa, S.</creatorcontrib><creatorcontrib>Nagahira, A.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on semiconductor manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Imaoka, K.</au><au>Ishii, Y.</au><au>Kikuchi, T.</au><au>Sugawa, S.</au><au>Nagahira, A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Highly Accurate Management in Dynamically Changing Fab</atitle><jtitle>IEEE transactions on semiconductor manufacturing</jtitle><stitle>TSM</stitle><date>2009-11-01</date><risdate>2009</risdate><volume>22</volume><issue>4</issue><spage>482</spage><epage>490</epage><pages>482-490</pages><issn>0894-6507</issn><eissn>1558-2345</eissn><coden>ITSMED</coden><abstract>Semiconductor fab capability improvement is usually discussed in the context of static conditions. 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| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Circuit properties Cycle time Digital circuits Dispatching Dynamics Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology Flash memory Flash memory (computers) General (including economical and industrial fields) Integrated circuits Integrated circuits by function (including memories and processors) Job shop scheduling Management Manufacturing processes Microelectronic fabrication (materials and surfaces technology) operation management Process control Production control Productivity Real time systems Segments Semiconductor device manufacture Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices semiconductor manufacturing Semiconductors Throughput work in process (WIP) control |
| title | Highly Accurate Management in Dynamically Changing Fab |
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