Nondestructive reverse engineering of trace maps in multilayered PCBs

The focus of this paper is on separating the layers of an unpopulated, two layered circuit card assemblies/printed circuit boards (CCA/PCB) using X-ray stereo imaging. By separating the layers, we mean that our desire is to separate the traces on each layer of any multi-layered CCA. The final end pr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Longbotham, H.G., Ping Yan, Kothari, H.N., Jun Zhou
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Adaptive signal processing Assembly Data mining Electrical engineering Electronic mail Feature extraction Layout Printed circuits Reverse engineering X-ray imaging
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