Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent
Due to environmental concerns, terpene based cleaning fluids have replaced Freon in cleaning baths at several AT&T manufacturing sites. The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60...
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| creator | Wong, C.P. Gillum, W.O. Walters, R.A. Sakach, P.J. Powell, D. Boomer, B. |
| description | Due to environmental concerns, terpene based cleaning fluids have replaced Freon in cleaning baths at several AT&T manufacturing sites. The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60 Sn/40 Pb solder. Recently, the use of terpene cleaning, BIOACT EC-7R, was extended to thin film ceramic substrates where high lead solder (95 Pb/5 Sn) forms the interconnection. In the presence of high lead solder, EC-7R quickly changes from colorless to bright yellow. In addition, the cleaning process deteriorates and residues are found on the circuits. Thus, the use of high lead solder leads to the replacement of the cleaning baths at shorter time intervals (four weeks) than when 60 Sn/40 Pb solder is present (6 months). The goal of the work discussed below is to elucidate the reactions between the circuit metallurgy and the EC-7R chemical composition. |
| doi_str_mv | 10.1109/ECTC.1995.517817 |
| format | Conference Proceeding |
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The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60 Sn/40 Pb solder. Recently, the use of terpene cleaning, BIOACT EC-7R, was extended to thin film ceramic substrates where high lead solder (95 Pb/5 Sn) forms the interconnection. In the presence of high lead solder, EC-7R quickly changes from colorless to bright yellow. In addition, the cleaning process deteriorates and residues are found on the circuits. Thus, the use of high lead solder leads to the replacement of the cleaning baths at shorter time intervals (four weeks) than when 60 Sn/40 Pb solder is present (6 months). The goal of the work discussed below is to elucidate the reactions between the circuit metallurgy and the EC-7R chemical composition.</description><identifier>ISBN: 0780327365</identifier><identifier>ISBN: 9780780327368</identifier><identifier>DOI: 10.1109/ECTC.1995.517817</identifier><language>eng</language><publisher>IEEE</publisher><subject>Ceramics ; Chemicals ; Cleaning ; Integrated circuit interconnections ; Lead ; Manufacturing ; Printed circuits ; Substrates ; Thin film circuits ; Tin</subject><ispartof>1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.1016-1027</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/517817$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/517817$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Wong, C.P.</creatorcontrib><creatorcontrib>Gillum, W.O.</creatorcontrib><creatorcontrib>Walters, R.A.</creatorcontrib><creatorcontrib>Sakach, P.J.</creatorcontrib><creatorcontrib>Powell, D.</creatorcontrib><creatorcontrib>Boomer, B.</creatorcontrib><title>Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent</title><title>1995 Proceedings. 45th Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>Due to environmental concerns, terpene based cleaning fluids have replaced Freon in cleaning baths at several AT&T manufacturing sites. The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60 Sn/40 Pb solder. Recently, the use of terpene cleaning, BIOACT EC-7R, was extended to thin film ceramic substrates where high lead solder (95 Pb/5 Sn) forms the interconnection. In the presence of high lead solder, EC-7R quickly changes from colorless to bright yellow. In addition, the cleaning process deteriorates and residues are found on the circuits. Thus, the use of high lead solder leads to the replacement of the cleaning baths at shorter time intervals (four weeks) than when 60 Sn/40 Pb solder is present (6 months). The goal of the work discussed below is to elucidate the reactions between the circuit metallurgy and the EC-7R chemical composition.</description><subject>Ceramics</subject><subject>Chemicals</subject><subject>Cleaning</subject><subject>Integrated circuit interconnections</subject><subject>Lead</subject><subject>Manufacturing</subject><subject>Printed circuits</subject><subject>Substrates</subject><subject>Thin film circuits</subject><subject>Tin</subject><isbn>0780327365</isbn><isbn>9780780327368</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1995</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj09LwzAchgMiTOfu4ilfoDV_mqQ5zlB1MByM7jzS5Jc20rXadIjf3sF8L8_l4YEXoUdKckqJfq5MbXKqtcgFVSVVN-ieqJJwprgUC7RK6ZNcVgjBC3KHPvZg3RzHIeEx4C62He7BepzG3sOU8E-cO_yy2a1NjSuTqT1OcIqZ_T7DeE7YXeQhDi2ewLYwzA_oNtg-weqfS3R4rWrznm13bxuz3maRkmLOgAlwxDkrlFIyUN7I0mnQgfGSaOYbSakEIYLzjQ_BKdkwohwrrCPSesmX6OnajQBw_JriyU6_x-tj_gc_jUuR</recordid><startdate>1995</startdate><enddate>1995</enddate><creator>Wong, C.P.</creator><creator>Gillum, W.O.</creator><creator>Walters, R.A.</creator><creator>Sakach, P.J.</creator><creator>Powell, D.</creator><creator>Boomer, B.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1995</creationdate><title>Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent</title><author>Wong, C.P. ; Gillum, W.O. ; Walters, R.A. ; Sakach, P.J. ; Powell, D. ; Boomer, B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i104t-e25ec0cca57776f13b68c9e9f238092db6116e55fcdbdffc76b207c24ac06ad63</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Ceramics</topic><topic>Chemicals</topic><topic>Cleaning</topic><topic>Integrated circuit interconnections</topic><topic>Lead</topic><topic>Manufacturing</topic><topic>Printed circuits</topic><topic>Substrates</topic><topic>Thin film circuits</topic><topic>Tin</topic><toplevel>online_resources</toplevel><creatorcontrib>Wong, C.P.</creatorcontrib><creatorcontrib>Gillum, W.O.</creatorcontrib><creatorcontrib>Walters, R.A.</creatorcontrib><creatorcontrib>Sakach, P.J.</creatorcontrib><creatorcontrib>Powell, D.</creatorcontrib><creatorcontrib>Boomer, B.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wong, C.P.</au><au>Gillum, W.O.</au><au>Walters, R.A.</au><au>Sakach, P.J.</au><au>Powell, D.</au><au>Boomer, B.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent</atitle><btitle>1995 Proceedings. 45th Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>1995</date><risdate>1995</risdate><spage>1016</spage><epage>1027</epage><pages>1016-1027</pages><isbn>0780327365</isbn><isbn>9780780327368</isbn><abstract>Due to environmental concerns, terpene based cleaning fluids have replaced Freon in cleaning baths at several AT&T manufacturing sites. The terpene formulations employed in semi-aqueous processes, typically, are used to deflux circuit boards where most of the interconnections are formed using 60 Sn/40 Pb solder. Recently, the use of terpene cleaning, BIOACT EC-7R, was extended to thin film ceramic substrates where high lead solder (95 Pb/5 Sn) forms the interconnection. In the presence of high lead solder, EC-7R quickly changes from colorless to bright yellow. In addition, the cleaning process deteriorates and residues are found on the circuits. Thus, the use of high lead solder leads to the replacement of the cleaning baths at shorter time intervals (four weeks) than when 60 Sn/40 Pb solder is present (6 months). The goal of the work discussed below is to elucidate the reactions between the circuit metallurgy and the EC-7R chemical composition.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.1995.517817</doi><tpages>12</tpages></addata></record> |
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| ispartof | 1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p.1016-1027 |
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| language | eng |
| recordid | cdi_ieee_primary_517817 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Ceramics Chemicals Cleaning Integrated circuit interconnections Lead Manufacturing Printed circuits Substrates Thin film circuits Tin |
| title | Reactions of high lead solders with BIOACT EC-7R semi-aqueous cleaning reagent |
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