Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond
A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help e...
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| creator | Fu-Yi Han Kung-Chung Lu Tzyy-Sheng Horng Jenshan Lin Hung-Hsiang Cheng Chi-Tsung Chiu Chih-Pin Hung |
| description | A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore, the ground-proximity effect on on-chip spiral inductors in a flip-chip package is presented for the first time in this modeling study. For practical applications, the established package models are used in a chip-package co-simulation to predict the degradation of figure of merit for the cascode LNA under packaged condition. |
| doi_str_mv | 10.1109/MWSYM.2009.5165768 |
| format | Conference Proceeding |
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To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore, the ground-proximity effect on on-chip spiral inductors in a flip-chip package is presented for the first time in this modeling study. For practical applications, the established package models are used in a chip-package co-simulation to predict the degradation of figure of merit for the cascode LNA under packaged condition.</description><identifier>ISSN: 0149-645X</identifier><identifier>ISBN: 1424428033</identifier><identifier>ISBN: 9781424428038</identifier><identifier>EISSN: 2576-7216</identifier><identifier>EISBN: 1424428041</identifier><identifier>EISBN: 9781424428045</identifier><identifier>DOI: 10.1109/MWSYM.2009.5165768</identifier><language>eng</language><publisher>IEEE</publisher><subject>Cascode LNA ; chip-package co-simulation ; Electric variables measurement ; figure of merit ; flip-chip package ; Inductors ; LAN interconnection ; Low-noise amplifiers ; package model ; Packaging ; Scattering parameters ; Semiconductor device measurement ; Semiconductor device modeling ; Spirals ; wire-bond package ; Wireless LAN</subject><ispartof>2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.601-604</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5165768$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5165768$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Fu-Yi Han</creatorcontrib><creatorcontrib>Kung-Chung Lu</creatorcontrib><creatorcontrib>Tzyy-Sheng Horng</creatorcontrib><creatorcontrib>Jenshan Lin</creatorcontrib><creatorcontrib>Hung-Hsiang Cheng</creatorcontrib><creatorcontrib>Chi-Tsung Chiu</creatorcontrib><creatorcontrib>Chih-Pin Hung</creatorcontrib><title>Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond</title><title>2009 IEEE MTT-S International Microwave Symposium Digest</title><addtitle>MWSYM</addtitle><description>A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. 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For practical applications, the established package models are used in a chip-package co-simulation to predict the degradation of figure of merit for the cascode LNA under packaged condition.</description><subject>Cascode LNA</subject><subject>chip-package co-simulation</subject><subject>Electric variables measurement</subject><subject>figure of merit</subject><subject>flip-chip package</subject><subject>Inductors</subject><subject>LAN interconnection</subject><subject>Low-noise amplifiers</subject><subject>package model</subject><subject>Packaging</subject><subject>Scattering parameters</subject><subject>Semiconductor device measurement</subject><subject>Semiconductor device modeling</subject><subject>Spirals</subject><subject>wire-bond package</subject><subject>Wireless LAN</subject><issn>0149-645X</issn><issn>2576-7216</issn><isbn>1424428033</isbn><isbn>9781424428038</isbn><isbn>1424428041</isbn><isbn>9781424428045</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNpFkNtKAzEYhOMJbKsvoDd5gdT8OexuvJNiVWipUEW9KtnsnzZ1u7tsthbf3ooFr2aYDwZmCLkCPgTg5mb6Nv-YDgXnZqgh0WmSHZE-KKGUyLiCY9IT-5ClApKTfyDlKelxUIYlSr-fk36Ma865ziDpkfWzdZ92GaolRe_RdZHWFe1WSH1YbluktacbbEP3aywdTWdz6mx0dYG0rHesqkNEajdNGXzA9paOy9AwtwoN_cI2biPdhRZZXlfFBTnztox4edABeR3fv4we2WT28DS6m7AAqe6Yli41NpOZThxmhgM4UWhpcudBgTHKWOA2l2AApQBhwGjlMTcyhyLfzx2Q67_egIiLpg0b234vDofJHyNpWr4</recordid><startdate>200906</startdate><enddate>200906</enddate><creator>Fu-Yi Han</creator><creator>Kung-Chung Lu</creator><creator>Tzyy-Sheng Horng</creator><creator>Jenshan Lin</creator><creator>Hung-Hsiang Cheng</creator><creator>Chi-Tsung Chiu</creator><creator>Chih-Pin Hung</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200906</creationdate><title>Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond</title><author>Fu-Yi Han ; Kung-Chung Lu ; Tzyy-Sheng Horng ; Jenshan Lin ; Hung-Hsiang Cheng ; Chi-Tsung Chiu ; Chih-Pin Hung</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-53c79a83856ce89011c2d539bcf1419949a10ab3191e321291954feb93b1db803</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Cascode LNA</topic><topic>chip-package co-simulation</topic><topic>Electric variables measurement</topic><topic>figure of merit</topic><topic>flip-chip package</topic><topic>Inductors</topic><topic>LAN interconnection</topic><topic>Low-noise amplifiers</topic><topic>package model</topic><topic>Packaging</topic><topic>Scattering parameters</topic><topic>Semiconductor device measurement</topic><topic>Semiconductor device modeling</topic><topic>Spirals</topic><topic>wire-bond package</topic><topic>Wireless LAN</topic><toplevel>online_resources</toplevel><creatorcontrib>Fu-Yi Han</creatorcontrib><creatorcontrib>Kung-Chung Lu</creatorcontrib><creatorcontrib>Tzyy-Sheng Horng</creatorcontrib><creatorcontrib>Jenshan Lin</creatorcontrib><creatorcontrib>Hung-Hsiang Cheng</creatorcontrib><creatorcontrib>Chi-Tsung Chiu</creatorcontrib><creatorcontrib>Chih-Pin Hung</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fu-Yi Han</au><au>Kung-Chung Lu</au><au>Tzyy-Sheng Horng</au><au>Jenshan Lin</au><au>Hung-Hsiang Cheng</au><au>Chi-Tsung Chiu</au><au>Chih-Pin Hung</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond</atitle><btitle>2009 IEEE MTT-S International Microwave Symposium Digest</btitle><stitle>MWSYM</stitle><date>2009-06</date><risdate>2009</risdate><spage>601</spage><epage>604</epage><pages>601-604</pages><issn>0149-645X</issn><eissn>2576-7216</eissn><isbn>1424428033</isbn><isbn>9781424428038</isbn><eisbn>1424428041</eisbn><eisbn>9781424428045</eisbn><abstract>A comprehensive study is presented to compare the effects between flip-chip and wire-bond packages on a front-end cascode low-noise amplifier (LNA) in a 2.4 GHz CMOS wireless local area network (WLAN) receiver. To construct the package electrical models, specific modeling dies are designed to help extract the equivalent-circuit elements from measured S-parameters for chip-package interconnects. Furthermore, the ground-proximity effect on on-chip spiral inductors in a flip-chip package is presented for the first time in this modeling study. For practical applications, the established package models are used in a chip-package co-simulation to predict the degradation of figure of merit for the cascode LNA under packaged condition.</abstract><pub>IEEE</pub><doi>10.1109/MWSYM.2009.5165768</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0149-645X |
| ispartof | 2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.601-604 |
| issn | 0149-645X 2576-7216 |
| language | eng |
| recordid | cdi_ieee_primary_5165768 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Cascode LNA chip-package co-simulation Electric variables measurement figure of merit flip-chip package Inductors LAN interconnection Low-noise amplifiers package model Packaging Scattering parameters Semiconductor device measurement Semiconductor device modeling Spirals wire-bond package Wireless LAN |
| title | Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond |
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