PSPICE simulation of effect of Ground Bounce in PCB
Now-a-days the demand on the operating speed of the devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the ldquoGround Bouncerdquo. This effect threatens the operation of high-speed digital...
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creator | Kumar, G.V.S. Kumar, N.S. |
description | Now-a-days the demand on the operating speed of the devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the ldquoGround Bouncerdquo. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described. Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool. |
format | Conference Proceeding |
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As the devices become faster, their output switching time decreases and causes the ldquoGround Bouncerdquo. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described. Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool.</description><identifier>ISBN: 8190357514</identifier><identifier>ISBN: 9788190357517</identifier><language>eng</language><publisher>IEEE</publisher><subject>Analytical models ; Circuit analysis ; Circuit simulation ; Conductors ; Dielectric substrates ; Educational institutions ; Equivalent circuits ; Ground bounce ; Impedance ; SPICE ; SPICE simulation ; Strips</subject><ispartof>2008 10th International Conference on Electromagnetic Interference & Compatibility, 2008, p.131-134</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5154225$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5154225$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Kumar, G.V.S.</creatorcontrib><creatorcontrib>Kumar, N.S.</creatorcontrib><title>PSPICE simulation of effect of Ground Bounce in PCB</title><title>2008 10th International Conference on Electromagnetic Interference & Compatibility</title><addtitle>INCEMIC</addtitle><description>Now-a-days the demand on the operating speed of the devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the ldquoGround Bouncerdquo. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described. Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool.</description><subject>Analytical models</subject><subject>Circuit analysis</subject><subject>Circuit simulation</subject><subject>Conductors</subject><subject>Dielectric substrates</subject><subject>Educational institutions</subject><subject>Equivalent circuits</subject><subject>Ground bounce</subject><subject>Impedance</subject><subject>SPICE</subject><subject>SPICE simulation</subject><subject>Strips</subject><isbn>8190357514</isbn><isbn>9788190357517</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2008</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotjMtqwzAQAAWl0CTNF_SiHzCstFo9jolJ00CghrbnIFsrUEnsYjuH_n1a2svMnOZOLL0KgORImQexnqZPAFDBOkBYCGzemkO9k1O5XM9xLkMvhyw5Z-7m39qPw7VPcvvDjmXpZVNvH8V9jueJ1_9eiY_n3Xv9Uh1f94d6c6yKcjRXuk0tpIg2dORDcpS9T0RknQuajXWokZCg84a9Ac6ROFtjbGxb63LAlXj6-xZmPn2N5RLH7xMpMloT3gC5KDtN</recordid><startdate>200811</startdate><enddate>200811</enddate><creator>Kumar, G.V.S.</creator><creator>Kumar, N.S.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>200811</creationdate><title>PSPICE simulation of effect of Ground Bounce in PCB</title><author>Kumar, G.V.S. ; Kumar, N.S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-2bdb0da369c589d75f88d55567792e4673235350c84e840efa5ef6446abb67f93</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Analytical models</topic><topic>Circuit analysis</topic><topic>Circuit simulation</topic><topic>Conductors</topic><topic>Dielectric substrates</topic><topic>Educational institutions</topic><topic>Equivalent circuits</topic><topic>Ground bounce</topic><topic>Impedance</topic><topic>SPICE</topic><topic>SPICE simulation</topic><topic>Strips</topic><toplevel>online_resources</toplevel><creatorcontrib>Kumar, G.V.S.</creatorcontrib><creatorcontrib>Kumar, N.S.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kumar, G.V.S.</au><au>Kumar, N.S.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>PSPICE simulation of effect of Ground Bounce in PCB</atitle><btitle>2008 10th International Conference on Electromagnetic Interference & Compatibility</btitle><stitle>INCEMIC</stitle><date>2008-11</date><risdate>2008</risdate><spage>131</spage><epage>134</epage><pages>131-134</pages><isbn>8190357514</isbn><isbn>9788190357517</isbn><abstract>Now-a-days the demand on the operating speed of the devices with larger number of input/output pins is increasing by leaps and bounds. As the devices become faster, their output switching time decreases and causes the ldquoGround Bouncerdquo. This effect threatens the operation of high-speed digital systems by causing false triggering and affects the signal integrity. This paper investigates the mechanisms causing ground bounce in PCB by deriving equivalent circuit. The techniques of reducing ground bounce are described. Time domain analysis of ground bounce has been performed for multiple traces using SPICE simulation tool.</abstract><pub>IEEE</pub><tpages>4</tpages></addata></record> |
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identifier | ISBN: 8190357514 |
ispartof | 2008 10th International Conference on Electromagnetic Interference & Compatibility, 2008, p.131-134 |
issn | |
language | eng |
recordid | cdi_ieee_primary_5154225 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Analytical models Circuit analysis Circuit simulation Conductors Dielectric substrates Educational institutions Equivalent circuits Ground bounce Impedance SPICE SPICE simulation Strips |
title | PSPICE simulation of effect of Ground Bounce in PCB |
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