Autocatalytic gold plating process for electronic packaging applications

An autocatalytic electroless gold process suitable for electronic packaging applications, particularly wirebonding needs, is described. This process yields high purity, non porous soft gold of any thickness that meets or exceeds all military specifications. The process can be used for a wide variety...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Gaudiello, J.G.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aging Assembly Ceramics Circuits Electronics packaging Gold Impurities Laminates Nickel Surface finishing
Online-Zugang:	Volltext bestellen
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