Vibration fatigue of surface mount technology (SMT) solder joints
Recent trends in reliability analysis of electronics has involved developing structural integrity models for predicting the failure free operating lifetime under vibratory and thermal environmental exposure. This paper describes a test program which was performed to obtain structural fatigue data fo...
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| creator | Liguore, S. Followell, D. |
| description | Recent trends in reliability analysis of electronics has involved developing structural integrity models for predicting the failure free operating lifetime under vibratory and thermal environmental exposure. This paper describes a test program which was performed to obtain structural fatigue data for SMT solder joints exposed to a random vibration environment. A total of eight printed circuit board specimens with nine surface mounted components were fabricated and tested. Vibration time to failure data for individual solder joints of the SMT components were recorded. These data became the basis for understanding the physics of "why and how" SMT solder joints fail under vibration loading. Using procedures similar to those developed for aerospace structures, a fatigue model was developed that is based on the physics of the problem. |
| doi_str_mv | 10.1109/RAMS.1995.513218 |
| format | Conference Proceeding |
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This paper describes a test program which was performed to obtain structural fatigue data for SMT solder joints exposed to a random vibration environment. A total of eight printed circuit board specimens with nine surface mounted components were fabricated and tested. Vibration time to failure data for individual solder joints of the SMT components were recorded. These data became the basis for understanding the physics of "why and how" SMT solder joints fail under vibration loading. Using procedures similar to those developed for aerospace structures, a fatigue model was developed that is based on the physics of the problem.</description><identifier>ISSN: 0149-144X</identifier><identifier>ISBN: 9780780324701</identifier><identifier>ISBN: 0780324706</identifier><identifier>EISSN: 2577-0993</identifier><identifier>DOI: 10.1109/RAMS.1995.513218</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aerospace testing ; Avionics ; Circuit testing ; Electronic equipment ; Fabrication ; Failure (mechanical) ; Failure analysis ; Fatigue ; Loads (forces) ; Mathematical models ; Network components ; Performance evaluation ; Physics ; Predictive models ; Printed circuit boards ; Printed circuits ; Reliability ; Soldered joints ; Soldering ; Surface mount technology ; Vibrations (mechanical)</subject><ispartof>Annual Reliability and Maintainability Symposium 1995 Proceedings, 1995, p.18-26</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c282t-25cc607336ef0ee4972b4f944e6c663d80a811b8d6893c8d4593cc38877bc0353</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/513218$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,4050,4051,25140,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/513218$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Liguore, S.</creatorcontrib><creatorcontrib>Followell, D.</creatorcontrib><title>Vibration fatigue of surface mount technology (SMT) solder joints</title><title>Annual Reliability and Maintainability Symposium 1995 Proceedings</title><addtitle>RAMS</addtitle><description>Recent trends in reliability analysis of electronics has involved developing structural integrity models for predicting the failure free operating lifetime under vibratory and thermal environmental exposure. This paper describes a test program which was performed to obtain structural fatigue data for SMT solder joints exposed to a random vibration environment. A total of eight printed circuit board specimens with nine surface mounted components were fabricated and tested. Vibration time to failure data for individual solder joints of the SMT components were recorded. These data became the basis for understanding the physics of "why and how" SMT solder joints fail under vibration loading. Using procedures similar to those developed for aerospace structures, a fatigue model was developed that is based on the physics of the problem.</description><subject>Aerospace testing</subject><subject>Avionics</subject><subject>Circuit testing</subject><subject>Electronic equipment</subject><subject>Fabrication</subject><subject>Failure (mechanical)</subject><subject>Failure analysis</subject><subject>Fatigue</subject><subject>Loads (forces)</subject><subject>Mathematical models</subject><subject>Network components</subject><subject>Performance evaluation</subject><subject>Physics</subject><subject>Predictive models</subject><subject>Printed circuit boards</subject><subject>Printed circuits</subject><subject>Reliability</subject><subject>Soldered joints</subject><subject>Soldering</subject><subject>Surface mount technology</subject><subject>Vibrations (mechanical)</subject><issn>0149-144X</issn><issn>2577-0993</issn><isbn>9780780324701</isbn><isbn>0780324706</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1995</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9kDlrw0AQhZccEMdxH1JtlaOQM3toj9KYXGATiJ2QTkirkSMja22tVPjfR8apAwNf873HYwi5ZjBmDOzjx2S-GDNr43HMBGfmhAx4rHUE1opTMrLaQH-CSw3sjAyASRsxKb8vyGUIawDQXMGATL7KrEnb0te06LHqkPqChq4pUod047u6pS26n9pXfrWn94v58oEGX-XY0LUv6zZckfMirQKO_jgkn89Py-lrNHt_eZtOZpHjhrcRj51ToIVQWACitJpnsrBSonJKidxAahjLTK6MFc7kMu7hhDFaZw5ELIbk7ti7bfyuw9AmmzI4rKq0Rt-FRPcJJZTVvXn7r8kPOw79Q3JzFEtETLZNuUmbfXL8p_gFhT9ldw</recordid><startdate>1995</startdate><enddate>1995</enddate><creator>Liguore, S.</creator><creator>Followell, D.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>7TC</scope></search><sort><creationdate>1995</creationdate><title>Vibration fatigue of surface mount technology (SMT) solder joints</title><author>Liguore, S. ; Followell, D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c282t-25cc607336ef0ee4972b4f944e6c663d80a811b8d6893c8d4593cc38877bc0353</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Aerospace testing</topic><topic>Avionics</topic><topic>Circuit testing</topic><topic>Electronic equipment</topic><topic>Fabrication</topic><topic>Failure (mechanical)</topic><topic>Failure analysis</topic><topic>Fatigue</topic><topic>Loads (forces)</topic><topic>Mathematical models</topic><topic>Network components</topic><topic>Performance evaluation</topic><topic>Physics</topic><topic>Predictive models</topic><topic>Printed circuit boards</topic><topic>Printed circuits</topic><topic>Reliability</topic><topic>Soldered joints</topic><topic>Soldering</topic><topic>Surface mount technology</topic><topic>Vibrations (mechanical)</topic><toplevel>online_resources</toplevel><creatorcontrib>Liguore, S.</creatorcontrib><creatorcontrib>Followell, D.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical Engineering Abstracts</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liguore, S.</au><au>Followell, D.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Vibration fatigue of surface mount technology (SMT) solder joints</atitle><btitle>Annual Reliability and Maintainability Symposium 1995 Proceedings</btitle><stitle>RAMS</stitle><date>1995</date><risdate>1995</risdate><spage>18</spage><epage>26</epage><pages>18-26</pages><issn>0149-144X</issn><eissn>2577-0993</eissn><isbn>9780780324701</isbn><isbn>0780324706</isbn><abstract>Recent trends in reliability analysis of electronics has involved developing structural integrity models for predicting the failure free operating lifetime under vibratory and thermal environmental exposure. This paper describes a test program which was performed to obtain structural fatigue data for SMT solder joints exposed to a random vibration environment. A total of eight printed circuit board specimens with nine surface mounted components were fabricated and tested. Vibration time to failure data for individual solder joints of the SMT components were recorded. These data became the basis for understanding the physics of "why and how" SMT solder joints fail under vibration loading. Using procedures similar to those developed for aerospace structures, a fatigue model was developed that is based on the physics of the problem.</abstract><pub>IEEE</pub><doi>10.1109/RAMS.1995.513218</doi><tpages>9</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0149-144X |
| ispartof | Annual Reliability and Maintainability Symposium 1995 Proceedings, 1995, p.18-26 |
| issn | 0149-144X 2577-0993 |
| language | eng |
| recordid | cdi_ieee_primary_513218 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Aerospace testing Avionics Circuit testing Electronic equipment Fabrication Failure (mechanical) Failure analysis Fatigue Loads (forces) Mathematical models Network components Performance evaluation Physics Predictive models Printed circuit boards Printed circuits Reliability Soldered joints Soldering Surface mount technology Vibrations (mechanical) |
| title | Vibration fatigue of surface mount technology (SMT) solder joints |
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